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GrowBag graphs for keyword ? (Num. hits/coverage)
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Results
Found 663 publication records. Showing 663 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
81 | Thorlindur Thorolfsson, Kiran Gonsalves, Paul D. Franzon |
Design automation for a 3DIC FFT processor for synthetic aperture radar: a case study. |
DAC |
2009 |
DBLP DOI BibTeX RDF |
FFT, SAR, TSV, 3DIC |
68 | Nermeen Hossam, John Ferguson |
Fast, Accurate Assembly-Level Physical Verification of 3DIC Packages. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
68 | Gopi Neela, Jeffrey Draper |
Congestion-aware optimal techniques for assigning inter-tier signals to 3D-vias in a 3DIC. |
3DIC |
2015 |
DBLP DOI BibTeX RDF |
|
68 | T. Robert Harris, Eric J. Wyers, Lee Wang, Samuel Graham, Georges Pavlidis, Paul D. Franzon, W. Rhett Davis |
Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks. |
3DIC |
2015 |
DBLP DOI BibTeX RDF |
|
68 | Vempati Srinivasa Rao |
IME's capabilities and programs in 2.5D/3DIC. |
3DIC |
2015 |
DBLP DOI BibTeX RDF |
|
68 | Isao Sugaya, Hajime Mitsuishi, Hidehiro Maeda, Kazuya Okamoto |
New precision wafer bonding technologies for 3DIC. |
3DIC |
2015 |
DBLP DOI BibTeX RDF |
|
68 | Neela Gopi, Jeffrey Draper |
Techniques for assigning inter-tier signals to bondpoints in a face-to-face bonded 3DIC. |
3DIC |
2013 |
DBLP DOI BibTeX RDF |
|
68 | Tao Zhang 0032, Guangyu Sun 0003 |
Using NEM relay to improve 3DIC cost efficiency. |
3DIC |
2011 |
DBLP DOI BibTeX RDF |
|
68 | Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim |
Design of capacitive-coupling-based simultaneously bi-directional transceivers for 3DIC. |
3DIC |
2011 |
DBLP DOI BibTeX RDF |
|
68 | Naoki Saito 0004, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura |
Mechanical and electrical reliability of copper interconnections for 3DIC. |
3DIC |
2011 |
DBLP DOI BibTeX RDF |
|
68 | Xin Liu 0015, Lei Wang 0070, Mini Jayakrishnan, Jingjing Lan, Hongyu Li, Chong Ser Choong, M. Kumarasamy Raja, Yongxin Guo, Wang Ling Goh, Jin He, Shan Gao, Minkyu Je |
A miniaturized heterogeneous wireless sensor node in 3DIC. |
3DIC |
2011 |
DBLP DOI BibTeX RDF |
|
68 | Vance Tyree |
3DIC multi-project-wafer program: A collaboration to provide fabrication access. |
3DIC |
2010 |
DBLP DOI BibTeX RDF |
|
68 | Grzegorz Deptuch |
3DIC multi-project fabrication run being organized by CMC/CMP/MOSIS and Tezzaron. |
3DIC |
2010 |
DBLP DOI BibTeX RDF |
|
55 | Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller |
Design and CAD for 3D integrated circuits. |
DAC |
2008 |
DBLP DOI BibTeX RDF |
thermal modeling, TSV, through silicon via, 3DIC |
55 | Hao Hua, Christopher Mineo, Kory Schoenfliess, Ambarish M. Sule, Samson Melamed, Ravi Jenkal, W. Rhett Davis |
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits. |
DAC |
2006 |
DBLP DOI BibTeX RDF |
trade off, design flow, temperature dependency, 3DIC |
42 | |
IEEE International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023 |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima |
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Po-Yao Chuang, Francesco Lorenzelli, Sreejit Chakravarty, Slimane Boutobza, Cheng-Wen Wu, Georges G. E. Gielen, Erik Jan Marinissen |
Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Koutaro Hachiya |
Measurement Point Selection Algorithms for Testing Power TSVs. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Joshua A. Stevens, Tse-Han Pan, Prasanth Prabu Ravichandiran, Paul D. Franzon |
Chiplet Set For Artificial Intelligence. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima |
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic |
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Somnath Pal, Liang Ye, James O'Callaghan, Fatih Bilge Atar, Cian O'Mathuna, Brian Corbett, Ranajit Sai, Sambuddha Khan |
A Study on a Tether-Less Approach Towards Micro-Transfer-Printing of Large-Footprint Power Micro-Inductor Chiplets. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Emre Can Durmaz, Carl Heine, Zhibo Cao, Jens Lehmann 0002, Dietmar Kissinger, Matthias Wietstruck |
SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Erik W. Masselink, Andrew Stark, Benjamin B. Yang, T. Robert Harris |
Review of Hybrid Integration Techniques for Integrating III-V Onta Silicon. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Pouria Zaghari, Sourish S. Sinha, Jong Eun Ryu, Paul D. Franzon, Douglas C. Hopkins |
Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | Priyank Kashyap, Prasanth Prabu Ravichandiran, Lee Wang, Dror Baron, Chau-Wai Wong, Tianfu Wu 0001, Paul D. Franzon |
Thermal Estimation for 3D-ICs Through Generative Networks. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
42 | |
IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021 |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier |
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Ziyue Zhang, Yingtao Ding, Baoyan Yang, Anrun Ren, Zhiming Chen 0001 |
A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-Via. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Koji Kiyoyama, Yoshihiko Horio, Takafumi Fukushima, Hiroyuki Hashimoto, Takemori Orima, Mitsumasa Koyanagi |
Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Yoshihiko Horio, Takemori Orima, Koji Kiyoyama, Mitsumasa Koyanagi |
Implementation of a Chaotic Neural Network Reservoir on a TSV/$\mu\text{Bump}$ Stacked 3D Cyclic Neural Network Integrated Circuit. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Prasanth Prabu Ravichandiran, Paul D. Franzon |
A Review of 3D-Dynamic Random-Access Memory based Near-Memory Computation. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Ankit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir |
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan |
Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Qianli Zhao, W. Rhett Davis |
A Virtual Platform for Object Detection Systems. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Patrick Krüger, Thomas Voß, Matthias Wietstruck |
Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through Thermocycling. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan |
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Ayano Furue, Satoshi Matsumoto |
Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulations. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima |
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Shinei Miyasaka, Satoshi Matsumoto |
Numerical predictions of 3D power-supply on chip taking into considerations of proximity effect. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Lee Baker, Robert Patti, Paul D. Franzon |
Multi-ANN embedded system based on a custom 3D-DRAM. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Sreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir |
Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Anthony Mastroianni, Benjamin Kerr, Jawad Nasrullah, Kevin Cameron, Hockshan James Wong, David Ratchkov, Joseph A. Reynick |
Proposed Standardization of Heterogenous Integrated Chiplet Models. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Yuske Ogushi, Satoshi Matsumoto |
Fully integrated transformer less floating gate driver for 3D power supply on chip. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
42 | |
2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019 |
3DIC |
2019 |
DBLP BibTeX RDF |
|
42 | Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka |
Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy |
An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Chia-Hsuan Lee 0003, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba |
Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Jing Tao, Hongyu Li, Peng Zhao, Yu Dian Lim, Anak Agung Alit Apriyana, Chuan Seng Tan |
Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, Kuan-Neng Chen |
Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Kei Sumita, Jun Takeyasu, Kimihiko Kato, Kasidit Toprasertpong, Mitsuru Takenaka, Shinichi Takagi |
Fabrication of High Quality InAs-on-Lnsulator Structures by Smart Cut Process with Reuse of InAs Wafers. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi |
Electrostatic Shield TSVs to Suppress Coupling Among Stacked ICs. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Taro Matsudaira, Shunsuke Shindo, Tomohiro Shimizu, Takeshi Ito, Shoso Shinguhara, Satoru Shimizu |
Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Han Kyeol Seo, Hae-Sung Park, Sarah Eunkyung Kim |
Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Sethavut Duangchan, Keisuke Yamamoto, Dong Wang, Hiroshi Nakashima, Akiyoshi Baba |
SiN used as a Stressor in Germanium-On-Insulator Substrate. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima |
Development of 3D-IC Embedded Flexible Hybrid System. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Hanna Soneda, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu |
Electrical Field Test Method of Resistive Open Defects between Dies by Quiescent Currents through Embedded Diodes. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Cheong-Ha Jung, Won Seo, Gu-sung Kim |
Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite Element Analysis. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Akira Matsuzawa |
A Universal ADC for Sensor Applications. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi |
Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Y. Kagawa, H. Iwamoto |
3D Integration Technologies for the Stacked CMOS Image Sensors. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Shunta Endo |
Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné |
Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Giuliano Sisto, Peter Debacker, Rongmei Chen, Geert Van der Plas, Richard Chou, Eric Beyne, Dragomir Milojevic |
Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Minami Nakayama, Seiya Abe, Satoshi Matsumoto |
Transformer-Less Floating Gate Driver for 3D Power SoC. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka |
Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Robert Fischbach, Tilman Horst, Jens Lienig |
A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Toshiaki Satoh, Hiroyuki Yotsuyanagi, Masaki Hashizume |
On Delay Elements in Boundary Scan Cells for Delay Testing of 3D IC Interconnection. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto |
Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Fumihiro Inoue, Julien Bertheau, Samuel Suhard, Alain Phommahaxay, Takuya Ohashi, Tetsuro Kinoshita, Yohei Kinoshita, Eric Beyne |
Protective Layer for Collective Die to Wafer Hybrid Bonding. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Srinivasan Gopal, Deukhyoun Heo, Tanay Karnik |
Hierarchical Design Methodology and Optimization for Proximity Communication based Contactless 3D ThruChip Interface. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Hae-Sung Park, Han Kyeol Seo, Sarah Eunkyung Kim |
Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim |
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Quy Dinh, Kazuo Kondo, Tetsuji Hirato |
Reduction of TSV Pumping. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Wei-Hsuan Yang, Jin-Fu Li 0001, Chun-Lung Hsu, Chi-Tien Sun, Shih-Hsu Huang |
A Built-in Self-Test Scheme for TSVs of Logic-DRAM Stacked 3D ICs. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima |
Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Tsukasa Miura, Masaki Sakakibara, Hirotsugu Takahashi, Tadayuki Taura, Keiji Tatani, Yusuke Oike, Takayuki Ezaki |
A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Yi-Chieh Tsai, Chia-Hsuan Lee 0003, Kuan-Neng Chen |
Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt |
Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | T. Robert Harris, W. Rhett Davis, Steven Lipa, W. Shepherd Pitts, Paul D. Franzon |
Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Miho Yamada, Shun Ono, Yasuo Arai, Ikuo Kurachi, Toru Tsuboyama, Masayuki Ikebe, Makoto Motoyoshi |
3D Integrated Pixel Sensor with Silicon-on-Insulator Technology for the International Linear Collider Experiment. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Ken Suzuki, Ryota Mizuno, Yutaro Nakoshi, Hideo Miura |
Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Fan-Hsuan Tang, Hsu-Yu Kao, Shih-Hsu Huang, Jin-Fu Li 0001 |
3D Test Wrapper Chain Optimization with I/O Cells Binding Considered. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Jubee Tada, Kazuto Takahashi, Ryusuke Egawa |
A Design Scheme for 3-D Stacked CNN Accelerators. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Koji Sakui, Takayuki Ohba |
High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka |
Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Akihiro Noriki, Takeru Amano, Daisuke Okamoto, Yasuyuki Suzuki, Kazuhiko Kurata |
Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Toru Aoki, Katsuyuki Takagi, Toshiyuki Takagi, Hiroki Kase, Akifumi Koike |
X-ray Photon-Counting Imager with CdTe/Si-LSI Stacking. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Hiroto Tanaka, Yoshiyuki Arai, Toshiyuki Jinda, Noboru Asahi, Katsumi Terada |
Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger |
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima |
Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Sreejith Kochupurackal Rajan, Ming Jui Li, Muhannad S. Bakir, Gary S. May |
High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Olivier Billoint, Karim Azizi-Mourier, Gerald Cibrario, Didier Lattard, Mehdi Mouhdach, Sébastien Thuries, Pascal Vivet |
Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano |
Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Akitsu Shigetou, Tilo H. Yang, C. Robert Kao |
Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Koji Hamaguchi, Mitsuki Nakata, Kouta Segawa, Naoya Suzuki, Toshihisa Nonaka |
Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Chuei-Tang Wang, Douglas Yu |
Power-Performance Advantages of InFO Technology for Advanced System Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Alit Apriyana Anak Agung, Peng Zhao, Chuan Seng Tan |
TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
42 | Masahiro Nomura |
Heat Transfer in Nanostructured Si and Heat Flux Control Technique. |
3DIC |
2019 |
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