Search results for "BGA"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
88	Kuk Won Ko, Young Jun Roh, Hyung Suck Cho, Hyung Cheol Kim	A Neural Network Approach to the Inspection of Ball Grid Array Solder Joints on Printed Circuit Boards.	IJCNN (5)	2000	DBLP DOI BibTeX RDF
83	Oscar Montiel, Oscar Castillo 0001, Patricia Melin, Roberto Sepúlveda	Application of a breeder genetic algorithm for filter optimization.	Nat. Comput.	2005	DBLP DOI BibTeX RDF	breeder, BGA, evolutionary algorithm, system identification, GA
53	Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Tsuzaka, Hiroshi Fujita 0001	Automated Solder Inspection Method by Means of X-ray Oblique Computed Tomography.	ICIP (5)	2007	DBLP DOI BibTeX RDF
48	Man-Fai Yu, Joel Darnauer, Wayne Wei-Ming Dai	Interchangeable pin routing with application to package layout.	ICCAD	1996	DBLP DOI BibTeX RDF	BGA, all-angle wiring, interchangeable pin routing, min-cost max-flow heuristic, multiple layers, octilinear wiring, package layout, pin redistribution, prerouted nets, rectilinear wiring, test fixture routing, triangulated routing network, CAD, NP-complete, ASIC, circuit layout CAD, speed, PGA, input output, routing problems
47	Joel A. Jorgenson, Russell J. Wagner	Design-For-Test in a Multiple Substrate Multichip Module.	J. Electron. Test.	1997	DBLP DOI BibTeX RDF	Multichip Module (MCM) Test, Known-Good Die (KGD), Ball Grid Array (BGA), Built-In-Self-Test (BIST), boundary-scan
35	Wen-Hui Yang, Dao-Qing Dai, Hong Yan 0001	Feature Extraction and Uncorrelated Discriminant Analysis for High-Dimensional Data.	IEEE Trans. Knowl. Data Eng.	2008	DBLP DOI BibTeX RDF	Pattern Recognition, Feature extraction or construction
35	Yukiko Kubo, Atsushi Takahashi 0001	Global Routing by Iterative Improvements for Two-Layer Ball Grid Array Packages.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2006	DBLP DOI BibTeX RDF
35	Yukiko Kubo, Atsushi Takahashi 0001	A global routing method for 2-layer ball grid array packages.	ISPD	2005	DBLP DOI BibTeX RDF	2-layer routing, ball grid array, cost graph, heuristic, global routing, monotonic, greedy
35	Oscar Montiel, Oscar Castillo 0001, Patricia Melin, Roberto Sepúlveda	Evolutionary Modeling Using A Wiener Model.	WSC	2004	DBLP DOI BibTeX RDF
35	Hans-Michael Voigt, Heinz Mühlenbein	Erroneous Truncation Selection - A Breeder's Decision Making Perspective.	PPSN	1996	DBLP DOI BibTeX RDF
35	Heinz Mühlenbein, Jürgen Bendisch, Hans-Michael Voigt	From Recombination of Genes to the Estimation of Distributions II. Continuous Parameters.	PPSN	1996	DBLP DOI BibTeX RDF
35	Dirk Schlierkamp-Voosen, Heinz Mühlenbein	Strategy Adaption by Competing Subpopulations.	PPSN	1994	DBLP DOI BibTeX RDF	breeder genetic algorithm, strategy adaptation, multiresolution search, competition
30	Rui Shi 0003, Chung-Kuan Cheng	Efficient escape routing for hexagonal array of high density I/Os.	DAC	2006	DBLP DOI BibTeX RDF	BGA, flip chip, hexagonal array, escape routing
25	Lei Tang 0002, Kangrong Li, Xingshe Zhou 0001, Qiao Yang, Penghui Pan, Daowei Wu, Baoxia Li, Yanling Wang, Nailiang Kuang, Liaoliao Zhang	Analytical equivalent circuit modeling and analysis of complex BGA for 3D silicon-interposer packaging.	Microelectron. J.	2024	DBLP DOI BibTeX RDF
25	Chuantao Hou, Long Wang, Liang Cao, Guoqing Chen, Peng Cao, Jianru Wang	Refined simulation method and failure study of BGA package structure based on image drive.	Microelectron. J.	2023	DBLP DOI BibTeX RDF
25	Long Wang, Chuantao Hou, Junxing Zheng, Peng Cao, Jianru Wang	Automated coplanarity inspection of BGA solder balls by structured light.	Microelectron. J.	2023	DBLP DOI BibTeX RDF
25	S. Cong, W. W. Zhang, P. Liu, Y. N. Han, Y. H. Tian	Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading.	Microelectron. J.	2022	DBLP DOI BibTeX RDF
25	Yidong Yuan, Tianmeng Zhang, Ziren Wang, Kaixuan Song, Lingyu Bi, Lu Tian, Jinchun Gao	Impact of ground solder ball failure in BGA package on near electric field radiation.	IEICE Electron. Express	2022	DBLP DOI BibTeX RDF
25	Ceren Türer Akdeniz, Zümray Dokur, Tamer Ölmez	Detection of BGA solder defects from X-ray images using deep neural network.	Turkish J. Electr. Eng. Comput. Sci.	2020	DBLP DOI BibTeX RDF
25	Jyun-Ru Jiang, Yun-Chih Kuo, Simon Yi-Hung Chen, Hung-Ming Chen	On Pre-Assignment Route Prototyping for Irregular Bumps on BGA Packages.	DATE	2020	DBLP DOI BibTeX RDF
25	Vikas Ahuja, Vijay Kumar Neeluru	Robust BGA Void Detection Using Multi Directional Scan Algorithms.	CoRR	2019	DBLP BibTeX RDF
25	Sandeep Mallampati, Zaeem Baig, Scott Pozder, Eng Chye Chua	A Comparison of Environmental Stressing Data and Simulation at the Corner of a Test Chip in a FC-BGA Package.	IRPS	2019	DBLP DOI BibTeX RDF
25	S. Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont	Creep measurement and choice of creep laws for BGA assemblies' reliability simulation.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
25	Jack Du	Reliability Analysis for High-Density PCA After Multiple BGA Reworks.	ICSRS	2018	DBLP DOI BibTeX RDF
25	Pawel Pawlowski, Adam Dabrowski, Marcin Grenz, Michal Bladowski	Reflow Oven for Heating and Soldering SMD and BGA Components.	MIXDES	2018	DBLP DOI BibTeX RDF
25	Hosung Lee, Sanghyeon Baeg, Nelson Hua, Shi-Jie Wen	Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
25	Tsung-Nan Tsai, Mika Liukkonen	Robust parameter design for the micro-BGA stencil printing process using a fuzzy logic-based Taguchi method.	Appl. Soft Comput.	2016	DBLP DOI BibTeX RDF
25	Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor	Lattice Boltzmann method study of bga bump arrangements on void formation.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
25	Christian Wittke, Zoya Dyka, Oliver Skibitzki, Peter Langendörfer	Preparation of SCA Attacks: Successfully Decapsulating BGA Packages.	SECITC	2016	DBLP DOI BibTeX RDF
25	Ankur Gupta, Mayank Shrivastava, Maryam Shojaei Baghini, Harald Gossner, V. Ramgopal Rao	A Fully-Integrated Radio-Frequency Power Amplifier in 28nm CMOS Technology Mounted in BGA Package.	VLSID	2016	DBLP DOI BibTeX RDF
25	R. Alberti, Riccardo Enrici Vaion, A. Mervic, S. Testa	Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
25	Fang Liu, Ye Lu 0002, Zhen Wang, Zhiming Zhang	Numerical simulation and fatigue life estimation of BGA packages under random vibration loading.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
25	Somchai Nuanprasert, Sueki Baba, Takashi Suzuki	An efficient method of occluded solder ball segmentation for automated BGA void defect inspection using X-ray images.	IECON	2015	DBLP DOI BibTeX RDF
25	Li Wang 0058, Rui Ma 0003, Fei Lu 0004, Albert Z. Wang, Zongyu Dong, Xin Wang 0031, Chen Zhang 0017, Bin Zhao 0002, Siqiang Fan, He Tang	Function-based ESD protection circuit design verification for BGA pad-ring array.	ASICON	2015	DBLP DOI BibTeX RDF
25	Fang Liu, Guang Meng	Random vibration reliability of BGA lead-free solder joint.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
25	Yao Yao 0003, Leon M. Keer	Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
25	Bo Wang, Jiajun Li, Anthony Gallagher, James Wrezel, Pongpinit Towashirporn, Naiqin Zhao	Drop impact reliability of Sn-1.0Ag-0.5Cu BGA interconnects with different mounting methods.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
25	Ming-Hung Shu, Bi-Min Hsu, Min-Chuan Hu	Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
25	Da Yu, Abdullah Al-Yafawi, Tung T. Nguyen, Seungbae Park, Soonwan Chung	High-cycle fatigue life prediction for Pb-free BGA under random vibration loading.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
25	Hsiu-Jen Lin, Tung-Han Chuang	Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
25	Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park	Effect of glue on reliability of flip chip BGA packages under thermal cycling.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
25	Mei-Ling Wu, Donald Barker	Rapid assessment of BGA life under vibration and bending, and influence of input parameter uncertainties.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
25	John G. Taylor	A roadmap for autonomous adaptive systems: The brain-guided attention (BGA) system.	IJCNN	2010	DBLP DOI BibTeX RDF
25	Keiko Oda, Takahiro Matsubara, Kei-ichiro Watanabe, Kaori Tanaka, Maraki Maetani	Optical Connection between Optical Via Hole in BGA Package and Optical Waveguide on Board.	IEICE Trans. Electron.	2009	DBLP DOI BibTeX RDF
25	Bálint Sinkovics, Olivér Krammer	Board level investigation of BGA solder joint deformation strength.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
25	Liyu Yang, Joseph B. Bernstein, T. Koschmieder	Assessment of acceleration models used for BGA solder joint reliability studies.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
25	Fang Liu, Guang Meng, Mei Zhao, Jun feng Zhao	Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
25	Luigi Pietro Maria Colombo, Davide Paleari, Alexey Petrushin	A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages.	Proc. IEEE	2009	DBLP DOI BibTeX RDF
25	Yih-Chih Chiou, Chern-Sheng Lin, Bor-Cheng Chiou	The feature extraction and analysis of flaw detection and classification in BGA gold-plating areas.	Expert Syst. Appl.	2008	DBLP DOI BibTeX RDF
25	Y. T. Chin, P. K. Lam, H. K. Yow, Teck Yong Tou	Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
25	N. Roth, Wolfgang Wondrak, A. Willikens, James Hofmeister	Ball grid array (BGA) solder joint intermittency real-time detection.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
25	Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim, Seung-Boo Jung	Effect of high-speed loading conditions on the fracture mode of the BGA solder joint.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
25	W. D. van Driel, A. Mavinkurve, Marcel A. J. van Gils, G. Q. Zhang	Advanced structural similarity rules for the BGA package family.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
25	Ja-Myeong Koo, Seung-Boo Jung	Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
25	Xin Qu, Zhaoyi Chen, Bo Qi, Taekoo Lee, Jiaji Wang	Board level drop test and simulation of leaded and lead-free BGA-PCB assembly.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
25	Hongxia Gao, Yueming Hu 0002, Haiming Liu 0003, Xiaosheng Fang	A Fast Method for Detecting and Locating BGA Based on Twice Grading and Linking Technique.	ISIC	2007	DBLP DOI BibTeX RDF
25	Jun Gao	Machine-Vision-Based Measurement of BGA Connector Solder Balls.	SNPD (2)	2007	DBLP DOI BibTeX RDF
25	Ming-Kun Chen, Cheng-Chi Tai, Yu-Jung Huang	Nondestructive analysis of interconnection in two-die BGA using TDR.	IEEE Trans. Instrum. Meas.	2006	DBLP DOI BibTeX RDF
25	Xia Liu, Valmiki K. Sooklal, Melody A. Verges, Michael C. Larson	Experimental study and life prediction on high cycle vibration fatigue in BGA packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
25	Ming-Yi Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu	Thermal deformation measurements and predictions of MAP-BGA electronic packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
25	Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong	Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
25	YoungBae Kim, Hiroshi Noguchi, Masazumi Amagai	Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
25	T. Kangasvieri, Olli Nousiainen, Jussi Putaala, Risto Rautioaho, J. Vähäkangas	Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
25	Dong-Jun Lee, Hyo S. Lee	Major factors to the solder joint strength of ENIG layer in FC BGA package.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
25	Bruno Foucher, J. Tomas, F. Mounsi, M. Jeremias	Life margin assessment with Physics of Failure Tools application to BGA packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
25	Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini	Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
25	Tong Yan Tee, Zhaowei Zhong	Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
25	Wen-Yu Lo, Ming-Dou Ker	Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
25	Yuko Sawada, Kozo Harada, Hirofumi Fujioka	Study of package warp behavior for high-performance flip-chip BGA.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
25	Reza Ghaffarian	Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
25	Mohammad Yunus, K. Srihari, James M. Pitarresi, Anthony Primavera	Effect of voids on the reliability of BGA/CSP solder joints.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
25	Jean-Yves Delétage, F. J.-M. Verdier, Bernard Plano, Yannick Deshayes, Laurent Béchou, Yves Danto	Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
25	Chi-Wei Ruo, Ching-Long Shih	Locating and checking of a BGA pin's position using gray level.	ICRA	2003	DBLP DOI BibTeX RDF
25	Rich Evans	A Package Design Perspective, "It will be BGA and Flip-Chip".	ISQED	2003	DBLP DOI BibTeX RDF
25	Kinuko Mishiro, Shigeo Ishikawa, Mitsunori Abe, Toshio Kumai, Yutaka Higashiguchi, Ken-ichiro Tsubone	Effect of the drop impact on BGA/CSP package reliability.	Microelectron. Reliab.	2002	DBLP DOI BibTeX RDF
25	Huimin Xie, Anand K. Asundi, Chai Gin Boay, Lu Yunguang, Jin Yu, Zhaowei Zhong, Bryan K. A. Ngoi	High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package.	Microelectron. Reliab.	2002	DBLP DOI BibTeX RDF
25	Y. C. Chan, P. L. Tu, K. C. Hung	Study of the self-alignment of no-flow underfill for micro-BGA assembly.	Microelectron. Reliab.	2001	DBLP DOI BibTeX RDF
25	Valentin Videkov, Slavka Tzanova, Radosvet Arnaudov, Nikolai Iordanov	New assembling technique for BGA packages without thermal processes.	Microelectron. Reliab.	2001	DBLP DOI BibTeX RDF
25	P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai	Study of micro-BGA solder joint reliability.	Microelectron. Reliab.	2001	DBLP DOI BibTeX RDF
25	Quan Qi	Reliability studies of two flip-chip BGA packages using power cycling test.	Microelectron. Reliab.	2001	DBLP DOI BibTeX RDF
25	Ulrich Bartling, Heinz Mühlenbein	Optimization of Large Scale Parcel Distribution Systems by the Breeder Genetic Algorithm (BGA).	ICGA	1997	DBLP BibTeX RDF
25	Heinz Mühlenbein, Dirk Schlierkamp-Voosen	The Science of Breeding and Its Application to the Breeder Genetic Algorithm (BGA).	Evol. Comput.	1993	DBLP DOI BibTeX RDF
18	Jin-Tai Yan, Zhi-Wei Chen	IO connection assignment and RDL routing for flip-chip designs.	ASP-DAC	2009	DBLP DOI BibTeX RDF
18	Jin-Tai Yan, Zhi-Wei Chen	RDL pre-assignment routing for flip-chip designs.	ACM Great Lakes Symposium on VLSI	2009	DBLP DOI BibTeX RDF	RDL routing, flip-chip design, routability, wirelength
18	Sertac Cinel, Cüneyt F. Bazlamaçci	A Distributed Heuristic Algorithm for the Rectilinear Steiner Minimal Tree Problem.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2008	DBLP DOI BibTeX RDF
18	Hong Liu 0002, Ke Wu, Peter Meusel, Nikolaus Seitz, Gerd Hirzinger, M. H. Jin, Yiwei Liu, Shaowei Fan, T. Lan, Zhaopeng Chen	Multisensory five-finger dexterous hand: The DLR/HIT Hand II.	IROS	2008	DBLP DOI BibTeX RDF
18	Farah Mohammadi 0001, Mohsen Marami	Dynamic compact thermal model of a package.	ISCAS	2008	DBLP DOI BibTeX RDF
18	Dongchul Kim, Taehoon Kim, Jung-A Lee, Yungseon Eo	Experimental Characterisations of Coupled Transmission Lines.	DELTA	2008	DBLP DOI BibTeX RDF	interconnect lines, signal transient, crosstalk, transmission line, s-parameters
18	Zhiwei Lin 0001, A. Benjamin Premkumar, A. S. Madhukumar	Receive antenna selection for MIMO-SM systems with linear MMSE receivers in the presence of unknown interference.	IEEE Trans. Wirel. Commun.	2007	DBLP DOI BibTeX RDF
18	Hui Liu, Zixing Cai, Yong Wang 0002	A new constrained optimization evolutionary algorithm by using good point set.	IEEE Congress on Evolutionary Computation	2007	DBLP DOI BibTeX RDF
18	Ren-Jie Lee, Ming-Fang Lai, Hung-Ming Chen	Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign.	ASP-DAC	2007	DBLP DOI BibTeX RDF
18	Hyunsik Kim, Yungseon Eo	High-Frequency-Measurement-Based Frequency-Variant Transmission Line Characterization and Circuit Modeling for Accurate Signal Integrity Verification.	ISQED	2007	DBLP DOI BibTeX RDF
18	Mohammed Bougataya, Ahmed Lakhsasi, Daniel Massicotte	Steady State Thermo-mechanical Stress Prediction for Large VLSI circuits using GDS Method.	CCECE	2006	DBLP DOI BibTeX RDF
18	Snehashis Roy, Sukumar Jairam, H. Udayakumar	A Methodology for Switching Activity Based IO Powerpad Optimisation.	VLSI Design	2006	DBLP DOI BibTeX RDF
18	David Minor, Shmuel Rippa	GRAPE - An Industrial Distributed System for Computer Vision.	IPDPS	2005	DBLP DOI BibTeX RDF
18	Roderick P. Cruz	Flip Chip Advanced Package Solder Joint Embrittlement Fault Isolation Using TDR.	ISQED	2004	DBLP DOI BibTeX RDF
18	George Lykakis, N. Mouratidis, Kyriakos Vlachos, Nikos A. Nikolaou, Stylianos Perissakis, G. Sourdis, George E. Konstantoulakis, Dionisios N. Pnevmatikatos, Dionisios I. Reisis	Efficient Field Processing Cores in an Innovative Protocol Processor System-on-Chip.	DATE	2003	DBLP DOI BibTeX RDF
18	Myung Hee Kim, Hyunseung Choo, Byung Ho Yae, Jonghyun Lee	A Practical RWA Algorithm Based on Lookup Table for Edge Disjoint Paths.	Human.Society@Internet 2003	2003	DBLP DOI BibTeX RDF
18	Sangman Moh, Kyoung Park, Sungnam Kim	KinCA: An InfiniBand Host Channel Adapter Based on Dual Processor Cores.	ISCIS	2003	DBLP DOI BibTeX RDF
18	Leon van de Logt, Frank van der Heyden, Tom Waayers	An extension to JTAG for at-speed debug on a system.	ITC	2003	DBLP DOI BibTeX RDF