Search results for "Packaging"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
78	Cathy Barnes, Christian Southee, Brian Henson	The impact of affective design of product packaging upon consumer purchase decisions.	DPPI	2003	DBLP DOI BibTeX RDF	packaging design, affective design
78	Debashis Basak, Dhabaleswar K. Panda 0001	Designing Clustered Multiprocessor Systems under Packaging and Technological Advancements.	IEEE Trans. Parallel Distributed Syst.	1996	DBLP DOI BibTeX RDF	k-ary n-cube interconnection, packaging constraints, interconnection networks, parallel architectures, Multiprocessor systems, clustered architectures, hierarchical organization, scalable systems
78	Eric Beyne	Tutorial T7A: Advanced IC Packaging.	VLSI Design	2007	DBLP DOI BibTeX RDF
69	William Reilly, Robert Wolfe, MacKenzie Smith	MIT's CWSpace project: packaging metadata for archiving educational content in DSpace.	Int. J. Digit. Libr.	2006	DBLP DOI BibTeX RDF	Content packaging, IMS-CP, Archiving websites, Learning objects, METS
65	Robert DeLine	Avoiding Packaging Mismatch with Flexible Packaging.	IEEE Trans. Software Eng.	2001	DBLP DOI BibTeX RDF	software architecture, software component, system integration, software packaging, Mismatch
64	John Zimmerman	Exploring the role of emotion in the interaction design of digital music players.	DPPI	2003	DBLP DOI BibTeX RDF	product packaging, kansei engineering, affective design
60	María Luisa Pérez-Delgado	Artificial Ants and Packaging Waste Recycling.	IWANN (2)	2009	DBLP DOI BibTeX RDF	Packaging Waste, Recycling, Artificial Ants
60	Reda Bendraou, Philippe Desfray, Marie-Pierre Gervais, Alexis Muller	MDA Tool Components: a proposal for packaging know-how in model driven development.	Softw. Syst. Model.	2008	DBLP DOI BibTeX RDF	Packaging of know-how, MDA Tool Component, MDD, Reusability
60	Sudarshan Bahukudumbi, Sule Ozev, Krishnendu Chakrabarty, Vikram Iyengar	AWafer-Level Defect Screening Technique to Reduce Test and Packaging Costs for "Big-D/Small-A" Mixed-Signal SoCs.	ASP-DAC	2007	DBLP DOI BibTeX RDF	mixed-signal cores, wafer-level defect screening, packaging cost reduction, big-D/small-A mixed-signal system-on-chip designs, mixed-signal SoC, consumer electronics market, wafer-level testing, correlation-based signature analysis, low-cost digital testers, generic cost model, mixed-signal test, digital logic, test cost reduction
60	Hiroshi Fujinoki, Murugesan Sanjay, Chintan Shah	Web File Transmission by Object Packaging - Performance Comparison with HTTP 1.0 and HTTP 1.1 Persistent Connection.	LCN	2003	DBLP DOI BibTeX RDF
55		FSA SiP Market and Patent Analysis Report.	IEEE Des. Test Comput.	2007	DBLP DOI BibTeX RDF	patent analysis, SiP market, SoC, packaging, SiP, system in package
55	Reda Bendraou, Philippe Desfray, Marie-Pierre Gervais	MDA Components: A Flexible Way for Implementing the MDA Approach.	ECMDA-FA	2005	DBLP DOI BibTeX RDF	PLE, Packaging of know-how, MDA Component, MDA, MDD, reusability
51	Nagendra Bhargava Bharatula, Paul Lukowicz, Gerhard Tröster	Functionality-power-packaging considerations in context aware wearable systems.	Pers. Ubiquitous Comput.	2008	DBLP DOI BibTeX RDF	Electronic packaging, Wearable computing, Gesture, Functionality, Context recognition, Miniaturization
51	Mark Markus, Markus Lassnig	Some Critical Remarks on Dynamic Packaging from the Perspective of SMEs and Small Tourism Destinations.	ENTER	2008	DBLP DOI BibTeX RDF	Dynamic Packaging Implementation, Potentials and Challenges
51	Ruey-Shun Chen, Kun-Chieh Yeh, Chan-Chine Chang, H. H. Chien	Using Data Mining Technology to improve Manufacturing Quality - A Case Study of LCD Driver IC Packaging Industry.	SNPD	2006	DBLP DOI BibTeX RDF	LCD driver IC packaging, Data mining, Decision tree, Data warehouse
51	Hiroshi Fujinoki, Kiran K. Gollamudi	Object Packaging - Web Response Time Reduction for Slow and Busy Web Server.	LCN	2002	DBLP DOI BibTeX RDF
46	S. Y. Kulkarni, K. D. Patil, K. V. V. Murthy	Transmission line model parameters for very high speed VLSI interconnects in MCMs using FEM with special elements.	VLSI Design	1995	DBLP DOI BibTeX RDF	very high speed integrated circuits, transmission line theory, integrated circuit packaging, transmission line model parameters, very high speed VLSI interconnects, higher order isoparametric elements, 2D interconnect/dielectric packaging structures, quadrilateral infinite elements, signal conductor boundaries, sharp corners, finite element method, finite element analysis, computation time, multichip modules, multichip modules, FEM, MCM, integrated circuit interconnections, VLSI interconnects
46	Joseph L. Hellerstein	Optimizing software packages for application management.	NOMS	2008	DBLP DOI BibTeX RDF
46	Nils H. Hagge, Bernardo Wagner	Implementation alternatives for the OMAC state machines using IEC 61499.	ETFA	2008	DBLP DOI BibTeX RDF
42	Lavanya Meherishi, Sushmita A. Narayana, K. S. Ranjani	Integrated product and packaging decisions with secondary packaging returns and protective packaging management.	Eur. J. Oper. Res.	2021	DBLP DOI BibTeX RDF
42	Dug Hee Moon, Kyeong Wook Shin, Chul Soon Park, Dong Soo Kim	A manufacturing system simulation of semiconductor packaging substrate.	SpringSim	2009	DBLP BibTeX RDF	lead frame, manufacturing system design, packaging substrate, discrete event simulation, semiconductor
42	Fabrizio Marinelli 0001, Maria Elena Nenni, Antonio Sforza	Capacitated lot sizing and scheduling with parallel machines and shared buffers: A case study in a packaging company.	Ann. Oper. Res.	2007	DBLP DOI BibTeX RDF	Scheduling, Packaging, Lot sizing
42	Cemal Basaran, Juan Gomez, Minghui Lin, Shidong Li	Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging.	SCSC	2007	DBLP BibTeX RDF	concurrent loading, electronics packaging reliability, solder joint life prediction, dynamic analysis
42	Hsin Rau, Chien-Ping Liao, Wei-Jung Shiang, Chiu-Hsiang Lin	Using Fuzzy Theory for Packaging Attribute Deployment for New Notebook Computer Introduction.	IEA/AIE	2007	DBLP DOI BibTeX RDF	new product introduction, TOPIS, packaging, FMEA, QFD
42	M. Niedermayer, Stephan Guttowski, Rolf Thomasius, David Dmitry Polityko, K. Schrank, Herbert Reichl	Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies.	IPSN	2006	DBLP DOI BibTeX RDF	3D packaging, hetero system integration, wireless sensor systems, design methodology
42	Wenzhao Li, Wei Wang, Min Gao, Junbo Wang	Research on Performance Test and Evaluation Method of Assembly Packaging Ammunition.	PROLAMAT	2006	DBLP DOI BibTeX RDF	Ammunition packaging, Rank sum test, Bayes method, T-test, Small samples
41	Jung Ho Ahn, Nathan L. Binkert, Al Davis, Moray McLaren, Robert S. Schreiber	HyperX: topology, routing, and packaging of efficient large-scale networks.	SC	2009	DBLP DOI BibTeX RDF
41	Jacob R. Minz, Sung Kyu Lim	Block-level 3-D Global Routing With an Application to 3-D Packaging.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2006	DBLP DOI BibTeX RDF
41	Jeroen Bekaert, Emiel De Kooning, Rik Van de Walle	Packaging models for the storage and distribution of complex digital objectsin archival information systems: a review of MPEG-21 DID principles.	Multim. Syst.	2005	DBLP DOI BibTeX RDF	Complex digital object, OAIS Reference Model, MPEG-21 DID
41	Peter Sandborn, Mike Vertal	Analyzing Packaging Trade-Offs During System Design.	IEEE Des. Test Comput.	1998	DBLP DOI BibTeX RDF
37	Paddy J. French	Integrated Microsystems in Industrial Applications.	SAMOS	2006	DBLP DOI BibTeX RDF	integrated sensors, packaging
37	Di Wu 0005, Zongkai Yang, Wenqing Cheng	A Standardized Visual Web-Based Courseware Authoring System.	ICALT	2005	DBLP DOI BibTeX RDF	Content Packaging, Question and Test Interoperability, Courseware Authoring, E-Learning, Learning Object Metadata
37	Ruimin Shen, Liping Shen, Xinwei Fan	e-Learning Content Management Based on Learning Object.	ICWL	2004	DBLP DOI BibTeX RDF	Modified dynamic Directed Acycline Graph (MDAG), Content Packaging Specification, Ontology, Learning Object, Meta-data
37	W. Stephen Lacy, José Cruz-Rivera, D. Scott Wills	The Offset Cube: A Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics.	IEEE Trans. Parallel Distributed Syst.	1998	DBLP DOI BibTeX RDF	MPP networks, ultra-compact systems, offset cube, 3D packaging, through-wafer signaling, adaptive routing, optical interconnect, deadlock freedom, 3D mesh
37	John Mugler, Thomas J. Naughton, Stephen L. Scott	OSCAR Meta-Package System.	HPCS	2005	DBLP DOI BibTeX RDF
37	J. S. Hebhardt, C. F. Groves, R. Bardas	NAA: an approach to analyzing backpanel crosstalk.	AFIPS National Computer Conference	1977	DBLP DOI BibTeX RDF
32	Muhammad Adeel Talib, Alan W. Colman, Jun Han 0004, Justin King, Malinda Kapuruge	A Service Packaging Platform for Delivering Services.	IEEE SCC	2010	DBLP DOI BibTeX RDF	service packaging platform, service delivery functions, service contracts
32	Florian Zach, Ulrike Gretzel, Daniel R. Fesenmaier	Tourist Activated Networks: Implications for Dynamic Packaging Systems in Tourism.	ENTER	2008	DBLP DOI BibTeX RDF	tourist activated networks, dynamic packaging, on-the-move traveller, destination management organizations, network analysis
32	M. B. Korchemkin	A heuristic partitioning algorithm for a packaging problem.	Computing	1983	DBLP DOI BibTeX RDF	Packaging problem, single source transportation problem, heuristic partitioning algorithm, large-scale 0-1 programming problem
32	Andreas Jagersberger, Klemens Waldhör	Dynamic Packaging using a Cluster-based Demographic Filtering Approach.	ENTER	2008	DBLP DOI BibTeX RDF	travel recommendation, demographic filtering, collaborative filtering, user model, content based filtering
32	Sai-Ho Ling, Herbert H. C. Iu, Frank H. F. Leung, Kit Yan Chan	Modelling the development of fluid dispensing for electronic packaging: Hybrid Particle Swarm Optimization based-wavelet neural network approach.	IJCNN	2008	DBLP DOI BibTeX RDF
32	Andrea Grassi, Elisa Gebennini, Gabriele Goldoni, Cesare Fantuzzi, Rita Gamberini, Robert Nevin, Bianca Rimini	Complex Packaging Line Modelling and Simulation.	ICRA	2007	DBLP DOI BibTeX RDF
32	Rakesh Murthy, Aditya N. Das, Dan O. Popa, Harry E. Stephanou	M3: Multiscale, Deterministic and Reconfigurable Macro-Micro Assembly System for Packaging of MEMS.	ICRA	2007	DBLP DOI BibTeX RDF
32	Cesar Augusto Tacla, Fabio Manoel Caliari, Gustavo Alberto Giménez Lugo	An Application Ontology for Furniture Packaging Design.	CSCWD	2007	DBLP DOI BibTeX RDF
32	Dongwon Seo, Yuhua Guo	Mismatch Compensated Design Techniques under Packaging-Induced Die Stress.	ISCAS	2007	DBLP DOI BibTeX RDF
32	Thierry Bodhuin	PODoJA: Packaging Optimizer for Downloadable Java Applications.	WCRE	2006	DBLP DOI BibTeX RDF
32	Takoua Abdellatif, Jakub Kornas, Jean-Bernard Stefani	J2EE Packaging, Deployment and Reconfiguration Using a General Component Model.	Component Deployment	2005	DBLP DOI BibTeX RDF
32	Steve Chu, Prasad V. Saraph, Lee Schruben	Packaging capacity analysis of a biopharmaceutical production operation.	WSC	2005	DBLP DOI BibTeX RDF
32	Lalitha Immaneni, Anju Kapur, Brett Neal	Design Tools for Packaging.	ISQED	2004	DBLP DOI BibTeX RDF
32	Zongkai Yang, Gang Zhao, Di Wu 0005, Jianhua He	A Standard Visual Courseware Authoring Tool Based on Content Packaging Specification.	ITCC (1)	2004	DBLP DOI BibTeX RDF
32	Osamu Wada, Toshimasa Namekawa, Hiroshi Ito, Atsushi Nakayama, Shuso Fujii	Post-Packaging Auto Repair Techniques for Fast Row Cycle Embedded DRAM.	ITC	2004	DBLP DOI BibTeX RDF
32	Lucimar C. Martins, Tatiana A. S. Coelho, Simone Diniz Junqueira Barbosa, Marco A. Casanova, Carlos José Pereira de Lucena	A Framework for Filtering and Packaging Hypermedia Documents.	AH	2002	DBLP DOI BibTeX RDF
32	Jennifer Blain Christen, Cristina E. Davis, Min Li, Andreas G. Andreou	Design, double sided post-processing, and packaging of CMOS compatible bio-MEMS device arrays.	ISCAS (1)	2002	DBLP DOI BibTeX RDF
32	Brian A. Box, John Nieznanski	Common processor element packaging for CHAMP.	FCCM	1995	DBLP DOI BibTeX RDF
32	Barry Whalen	Automating the Design of Electronic Packaging (tutorial).	DAC	1988	DBLP BibTeX RDF
28	Xin Gao, Wenjing Luo, Yu Liu, Bo Zhong	Analysis of the Effectiveness of Integrating Traditional Chinese Medicine Culture and Tang Grass Pattern into Medicinal Packaging Design for User Experience Enhancement - Simulation and Modeling based on SNNs Neural Network FittingIntegrating Traditional Chinese Medicine Culture and Tang Grass Pattern into Medicinal Packaging Design for User Experience Enhancement.	ISAIMS	2023	DBLP DOI BibTeX RDF
28	Stephan L. K. Freichel, Johannes Wollenburg, Johannes K. Wörtge	The role of packaging in omni-channel fashion retail supply chains - How can packaging contribute to logistics efficiency?	Logist. Res.	2020	DBLP DOI BibTeX RDF
28	Mónica Forero-Díaz, Brayan D. Sanchez Correa, Mauricio Salas Román, Miguel A. Buitrago Casas	Challenges for the design of people-centered pharmaceutical packaging: Exploration of the interaction of people with pharmaceutical packaging.	PervasiveHealth	2020	DBLP DOI BibTeX RDF
28	Austin Lancaster, Manish Keswani	Integrated circuit packaging review with an emphasis on 3D packaging.	Integr.	2018	DBLP DOI BibTeX RDF
28	Jakkreeporn Sannork, Aree Wiboonpongse, Tzong-Ru Lee	Assessing Consumers' Perceptions of Packaging Attributes and Packaging Label of Community's 'Green' Chili (Pepper) Products in Thailand.	IUKM	2018	DBLP DOI BibTeX RDF
28	Yu-Che Huang, Ming-Yu Hsiao, Hong-Jin Yi, Tien-Chaun Yeh	A teaching research for packaging design in brand building: a case study of tea packaging in Teama.	ICETC	2018	DBLP DOI BibTeX RDF
28	Michihiro Inoue, Fumito Imura, Arami Saruwatari, Shiro Hara	Packaging in minimal fab: An integrated semiconductor line from wafer process to packaging process.	ICICDT	2016	DBLP DOI BibTeX RDF
28	Chong Leong Gan, Uda Hashim	Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
28	Guotao Wang, Paul S. Ho, Steven Groothuis	Chip-packaging interaction: a critical concern for Cu/low k packaging.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
28	Robert DeLine	Corrections to 'Avoiding Packaging Mismatch with Flexible Packaging'.	IEEE Trans. Software Eng.	2001	DBLP DOI BibTeX RDF
28	Robert DeLine	Avoiding Packaging Mismatch with Flexible Packaging.	ICSE	1999	DBLP DOI BibTeX RDF
28	Pedro Ortiz, Neil Keegan, Julia Spoors, John Hedley, Alun Harris, Jim Burdess, Richie Burnett, Margit Biehl, Werner Haberer, Thomas Velten, Matthew Solomon, Andrew Campitelli, Calum McNeil	A Cancer Diagnostics Biosensor System Based on Micro- and Nano-technologies.	NanoNet	2009	DBLP DOI BibTeX RDF	clinical diagnostics, microfluidics, packaging, biosensors, Lab-on-a-Chip, bioMEMS
28	Tariq Mahmood, Francesco Ricci 0001, Adriano Venturini	Learning Adaptive Recommendation Strategies for Online Travel Planning.	ENTER	2009	DBLP DOI BibTeX RDF	Dynamic Packaging, Information Presentation and Delivery, Reinforcement Learning, Markov Decision Process, Travel Planning, Conversational Recommender Systems
28	Philip Doganis, Haralambos Sarimveis	Optimal production scheduling for the dairy industry.	Ann. Oper. Res.	2008	DBLP DOI BibTeX RDF	Yogurt, Scheduling, Optimization, Parallel machines, Mixed-integer linear programming, Packaging
28	Wilkey Wong, Ximena Uribe-Zarain, Roberta Golinkoff, Kelly Fisher, Kathy Hirsh-Pasek	Parents' views of the benefits claimed in educational toy advertising.	IDC	2008	DBLP DOI BibTeX RDF	parental perceptions, toy packaging, advertising, influence, purchasing, cognitive development, sensory
28	Yuen-Hui Chee, Mike Koplow, Michael Mark, Nathan Pletcher, Mike Seeman, Fred L. Burghardt, Dan Steingart, Jan M. Rabaey, Paul K. Wright, Seth Sanders	PicoCube: a 1 cm3 sensor node powered by harvested energy.	DAC	2008	DBLP DOI BibTeX RDF	active antennas, advanced packaging, low power, energy management, energy harvesting, intelligent sensors
28	Bharat Upadrasta, Mohammad T. Khasawneh, Sarah S. Lam	Advanced Technology Training for Operating the Microlithography Panel Printer.	HCI (12)	2007	DBLP DOI BibTeX RDF	electronics packaging, simulation, modeling, Virtual reality, training
28	Andrew Yang, Rajit Chandra, Simon Burke, Javier A. DeLaCruz, Sribalan Santhanam, Uming Ko	Entering the hot zone - can you handle the heat and be cool?	DAC	2006	DBLP DOI BibTeX RDF	IC packaging, thermal effects, low power
28	Vijay Lakamraju, Israel Koren, C. Mani Krishna 0001	Filtering Random Graphs to Synthesize Interconnection Networks with Multiple Objectives.	IEEE Trans. Parallel Distributed Syst.	2002	DBLP DOI BibTeX RDF	fault tolerance, Interconnection networks, synthesis, filters, embedding, diameter, packaging, random regular graphs
28	Ines Grützner, Niniek Angkasaputra, Dietmar Pfahl	A systematic approach to produce small courseware modules for combined learning and knowledge management environements.	SEKE	2002	DBLP DOI BibTeX RDF	courseware module production, knowledge packaging, CSCL
28	Sadik C. Esener, Philippe J. Marchand	Present and Future Needs of Free-Space Optical Interconnects.	IPDPS Workshops	2000	DBLP DOI BibTeX RDF	Optical Packaging, Micro-optics, Free-Space Optical Interconnects, Optical Interconnects, OptoElectronics
28	Jun Han	A Comprehensive Interface Definition Framework for Software Components.	APSEC	1998	DBLP DOI BibTeX RDF	component interface, interface signature, interface constraint, role-based interface packaging and configuration, software component, Component based software engineering
28	T. Boggess, F. Shirley	High-performance scalable computing for real-time applications.	ICCCN	1997	DBLP DOI BibTeX RDF	high-performance scalable computing, interconnect technologies, high-performance computing technologies, embedded military applications, heterogeneous computer nodes, high-throughput system area network, standardized intelligent node-to-network interface, LANai, Sanders, Ptolemy environment, high density interconnect packaging, avionics applications, PacketWay, Internet Engineering Task Force proposed standard, high speed inter-SAN encryption, simulation, modeling, real-time systems, reconfigurable computing, real-time applications, RISC, switched network, digital signal processor, Myrinet
28	Kai-Yuan Chao, D. F. Wong 0001	Signal integrity optimization on the pad assignment for high-speed VLSI design.	ICCAD	1995	DBLP DOI BibTeX RDF	pad assignment, simultaneous swiching Noise, floorplanning, crosstalk, signal integrity, packaging
27	Santhosh Coimbatore Vaidyanathan, Amit Mangesh Brahme, Sukumar Jairam	Techniques for Early Package Closure in System-in-Packages.	ISQED	2008	DBLP DOI BibTeX RDF	spacer, landing, SoC, SIP, CSP, MCM, POP
27	Ray T. Chen	Optical interconnects: a viable solution for interconnection beyond 10 gbit/sec.	ISPD	2007	DBLP DOI BibTeX RDF	PCB interconnects, optical bus architecture, optical interconnects
27	Ryan Gerard, Robert R. Downs, James J. Marshall, Robert E. Wolfe	The Software Reuse Working Group: A Case Study in Fostering Reuse.	IRI	2007	DBLP DOI BibTeX RDF
27	Amit K. Gupta, William J. Dally	Topology optimization of interconnection networks.	IEEE Comput. Archit. Lett.	2006	DBLP DOI BibTeX RDF
27	Larry Gilg	Known Good Die.	J. Electron. Test.	1997	DBLP DOI BibTeX RDF	known good die, KGD, chip scale (size) package, multi-chip module (MCM), wafer probe, membrane probe card, buckling beam probe card, KGD carrier, CSP, burn-in
27	Shekar Rao, Bert Haskell, Ian Yee	Trade-off analysis on cost and manufacturing technology of an electronic product: Case study.	J. Electron. Test.	1994	DBLP DOI BibTeX RDF	analysis of PCB (printed circuit boards), Benchmarking, trade-off, redesign
27	Changsheng Ying, Jun Gu	Automated pin grid array package routing on multilayer ceramic substrates.	IEEE Trans. Very Large Scale Integr. Syst.	1993	DBLP DOI BibTeX RDF
23	Joseph Fjelstad	Retrospective on electronics technology and prospective methods for co-design of IC packaging and manufacturing improvements.	ISQED	2009	DBLP DOI BibTeX RDF
23	Zhengjia Wang, Yuhui Wang, Zhouping Yin	A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging.	ICIRA (2)	2008	DBLP DOI BibTeX RDF	Anisotropic conductive adhesive (ACA), coupled field, multi-physics simulation, optimization, reliability
23	Yanjie Liu, Teng Li, Lining Sun	Modeling and Control of Macro-micro Dual-Drive High Acceleration and High Precision Positioning Stage Using for IC Packaging.	ICIRA (2)	2008	DBLP DOI BibTeX RDF	macro-micro dual-drive, positioning stage, motion couple, LQG, modeling
23	Markus Luetzelschwab, Dominik Weiland, Marc P. Y. Desmulliez	Adaptive Packaging Solution for a Microlens Array Placed Over a Micro-UV-LED Array.	IPAS	2008	DBLP DOI BibTeX RDF
23	Steve Davis 0001, M. G. King, John W. Casson, John O. Gray, Darwin G. Caldwell	Automated Handling, Assembly and Packaging of Highly Variable Compliant Food Products - Making a Sandwich.	ICRA	2007	DBLP DOI BibTeX RDF
23	Kyung Ho Chung, Myung Sil Choi, Kwang Seon Ahn	A Study on the Packaging for Fast Boot-up Time in the Embedded Linux.	RTCSA	2007	DBLP DOI BibTeX RDF
23	Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee	Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	wire bonded plastic ball grid array, WB-PBGA, 40 Gb/s Serial Link, chip-to-chip serial link, SiP, System-in-Package
23	Dan O. Popa, Rakesh Murthy, Manoj Mitta, Jeongsik Sin, Harry E. Stephanou	M3-Modular Multi-Scale Assembly System for MEMS Packaging.	IROS	2006	DBLP DOI BibTeX RDF
23	Shweta Rani, Jay Goodkin, Judy Cobb, Thomas G. Habing, Richard Urban, Janet Eke, Richard Pearce-Moses	Technical architecture overview: tools for acquisition, packaging and ingest of web objects into multiple repositories.	JCDL	2006	DBLP DOI BibTeX RDF	interoperability architecture, digital preservation, web archiving
23	Renshen Wang, Rui Shi 0003, Chung-Kuan Cheng	Layer minimization of escape routing in area array packaging.	ICCAD	2006	DBLP DOI BibTeX RDF	bottleneck analysis, central triangular pattern, escape routing
23	Radoslav Andreev, Ivan Ganchev, Mairtin O'Droma	Content Metadata Application and Packaging Service (CMAPS) - Innovative Framework for Producing SCORM-Compliant e-Learning Content.	ICALT	2005	DBLP DOI BibTeX RDF
23	Noriaki Sakamoto, Norihiko Sugita, Takafumi Kikuchi, Hideki Tanaka, Takashi Akazawa	Designing and packaging technology of Renesas SIP.	ISCAS (6)	2005	DBLP DOI BibTeX RDF
23	Manling Tan, Xin Zeng	The Use of VRML in Assessing Colour in Soft Drink Packaging Design.	IV	2004	DBLP DOI BibTeX RDF
23	Nicolás de Abajo, Alberto B. Diez, Vanesa Lobato, Sergio R. Cuesta	ANN quality diagnostic models for packaging manufacturing: an industrial data mining case study.	KDD	2004	DBLP DOI BibTeX RDF	tinplate quality, ANNs, FMEA, CRISP-DM