Search results for "System-in-Package"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
42	Thomas Brandtner	Chip-Package Codesign Flow for Mixed-Signal SiP Designs.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	Mixed-Signal System-in-Package design, SiP
41	Davide Appello, Paolo Bernardi, Michelangelo Grosso, Matteo Sonza Reorda	System-in-Package Testing: Problems and Solutions.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	IEEE1500 SECT, KGD, System-on-Chip, SoC, test access mechanism, SiP, System-in-Package, System-on-Package
36	Anna Fontanelli	System-in-Package Technology: Opportunities and Challenges.	ISQED	2008	DBLP DOI BibTeX RDF	IO Planning, Co-design, Stack, System in Package
36	De-Yu Liu, Wai-Kei Mak, Ting-Chi Wang	Temperature-constrained fixed-outline floorplanning for die-stacking system-in-package design.	ACM Great Lakes Symposium on VLSI	2010	DBLP DOI BibTeX RDF	wire bonding, floorplanning, system-in-package
36	T. M. Mak	Is System in Package the Panacea for Integration?	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	integration, SiP, System in Package
31	Vijay K. Madisetti	Electronic System, Platform, and Package Codesign.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	System-Level Design Automation, Electronic Packaging, System-on-Chip, Platform-Based Design, System-in-Package, System-on-Package
31	Rohan Mandrekar, Krishna Bharath, Krishna Srinivasan, Ege Engin, Madhavan Swaminathan	System level signal and power integrity analysis methodology for system-in-package applications.	DAC	2006	DBLP DOI BibTeX RDF	modal decomposition, nodal admittance matrix method, system-in-package (SiP), causality, signal integrity, finite difference method, power integrity
30	Daniele Rossi 0001, Paolo Angelini, Cecilia Metra, Giovanni Campardo, Gian Pietro Vanalli	Risks for Signal Integrity in System in Package and Possible Remedies.	ETS	2008	DBLP DOI BibTeX RDF	Crosstalk, Error Detecting Codes, Signal Integrity, System in Package
29	Paolo Pulici, Gian Pietro Vanalli, Michele A. Dellutri, Domenico Guarnaccia, Filippo Lo Iacono, Giovanni Campardo, Giancarlo Ripamonti	Signal Integrity Flow for System-in-Package and Package-on-Package Devices.	Proc. IEEE	2009	DBLP DOI BibTeX RDF
25		FSA SiP Market and Patent Analysis Report.	IEEE Des. Test Comput.	2007	DBLP DOI BibTeX RDF	patent analysis, SiP market, SoC, packaging, SiP, system in package
25	Bruce C. Kim, Yervant Zorian	Guest Editors' Introduction: Big Innovations in Small Packages.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	SiP, System in package
25	Kwang-Ting (Tim) Cheng	The Need for a SiP Design and Test Infrastructure.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	SiP, system in package
25	Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee	Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	wire bonded plastic ball grid array, WB-PBGA, 40 Gb/s Serial Link, chip-to-chip serial link, SiP, System-in-Package
20	Nachiket V. Desai, Harish K. Krishnamurthy, Suhwan Kim, Christopher Schaef, Sheldon Weng, Beomseok Choi, William J. Lambert, Krishnan Ravichandran, James W. Tschanz, Vivek De	Fully Integrated Voltage Regulators with Package-Embedded Inductors for Heterogeneous 3D-TSV-Stacked System-in-Package with 22nm CMOS Active Silicon Interposer Featuring Self-Trimmed, Digitally Controlled ON-Time Discontinuous Conduction Mode (DCM) Operation.	VLSI Technology and Circuits	2022	DBLP DOI BibTeX RDF
20	Yin Tian, Guangming Wang, Yexi Song, Jie Yang, Yu Cao, Wei Tong, Yijun Chen, Shiwen Tang	A compact Ka-band antenna-in-package for system-in-package application.	IEICE Electron. Express	2017	DBLP DOI BibTeX RDF
19	Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He 0001, Tianpei Zhang, Robi Dutta, Xianlong Hong	Topological routing to maximize routability for package substrate.	DAC	2008	DBLP DOI BibTeX RDF	IC package, substrate routing, system in package
19	Ki Jin Han, Madhavan Swaminathan, Ege Engin	Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects.	DAC	2008	DBLP DOI BibTeX RDF	conduction mode basis function, electric field integral equation, proximity effect, system-in-package, skin effect, 3-D integration
19	Vincent Kerzerho, Philippe Cauvet, Serge Bernard, Florence Azaïs, Mariane Comte, Michel Renovell	A Novel DFT Technique for Testing Complete Sets of ADCs and DACs in Complex SiPs.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	DFT, ADC, mixed-signal testing, SiP, DAC, system-in-package
19	Lech Józwiak	Life-Inspired Systems.	DSD	2004	DBLP DOI BibTeX RDF	Life-inspired Systems, Silicon and System Complexity, Embedded Systems, System on Chip, Design Methodology, System in Package
18	Bill McCaffrey	Exploring the Challenges in Creating a High-Quality Mainstream Design Solution for System-in-Package (SiP) Design.	ISQED	2005	DBLP DOI BibTeX RDF
17	Peter Rickert, William Krenik	Cell Phone Integration: SiP, SoC, and PoP.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	PiP, analog integration, RF integration, memory integration, SoC, SiP, PoP
17	Jinjun Xiong, Yiu-Chung Wong, Egino Sarto, Lei He 0001	Constraint driven I/O planning and placement for chip-package co-design.	ASP-DAC	2006	DBLP DOI BibTeX RDF
17	Philippe Cauvet, Serge Bernard, Michel Renovell	System-in-Package, a Combination of Challenges and Solutions.	ETS	2007	DBLP DOI BibTeX RDF
17	Erdem Serkan Erdogan, Sule Ozev, Philippe Cauvet	Diagnosis of assembly failures for System-in-Package RF tuners.	ISCAS	2008	DBLP DOI BibTeX RDF
12	Shota Nakabeppu, Nobuyuki Yamasaki, Kenta Suzuki, Keizo Hiraga, Kazuhiro Bessho	A Non-stop Fault-Tolerant Real-Time System-on-Chip/System-in-Package.	candar	2023	DBLP DOI BibTeX RDF
12	Tayyab Shabbir, Rashid Saleem 0001, Samir Salem Al-Bawri, Muhammad Farhan Shafique, Mohammad Tariqul Islam 0001	Eight-Port Metamaterial Loaded UWB-MIMO Antenna System for 3D System-in-Package Applications.	IEEE Access	2020	DBLP DOI BibTeX RDF
12	Atif Shamim, Muhammad Arsalan, Langis Roy, Maitham Shams, Nicolas G. Tarr	Wireless Dosimeter: System-on-Chip Versus System-in-Package for Biomedical and Space Applications.	IEEE Trans. Circuits Syst. II Express Briefs	2008	DBLP DOI BibTeX RDF
12	Ahmed Amine Jerraya	EuroSoC: towards a joint university/industry research infrastructure for system on chip and system in package.	ASP-DAC	2004	DBLP DOI BibTeX RDF
12	Cynthia Trigas	Design challenges for system-in-package vs system-on-chip.	CICC	2003	DBLP DOI BibTeX RDF
12	Meng-Syue Chan, Chun-Yao Wang, Yung-Chih Chen	An efficient approach to sip design integration.	ISQED	2009	DBLP DOI BibTeX RDF
12	Yervant Zorian, Bruce C. Kim	Session Abstract.	VTS	2006	DBLP DOI BibTeX RDF
12	Noriaki Sakamoto, Norihiko Sugita, Takafumi Kikuchi, Hideki Tanaka, Takashi Akazawa	Designing and packaging technology of Renesas SIP.	ISCAS (6)	2005	DBLP DOI BibTeX RDF
11	Wei Tang 0010, Sung-Gun Cho, Tim Tri Hoang, Jacob Botimer, Wei Qiang Zhu, Ching-Chi Chang, Cheng-Hsun Lu, Junkang Zhu, Yaoyu Tao, Tianyu Wei, Naomi Kavi Motwani, Mani Yalamanchi, Ramya Yarlagadda, Sirisha Rani Kale, Mark Flanigan, Allen Chan, Thungoc Tran, Sergey Y. Shumarayev, Zhengya Zhang	Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration.	IEEE J. Solid State Circuits	2024	DBLP DOI BibTeX RDF
11	Md Sami Ul Islam Sami, Tao Zhang, Amit Mazumder Shuvo, Md. Saad Ul Haque, Paul Calzada, Kimia Zamiri Azar, Hadi Mardani Kamali, Fahim Rahman, Farimah Farahmandi, Mark M. Tehranipoor	Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration.	IEEE Access	2024	DBLP DOI BibTeX RDF
11	Tao Zhang, Md Latifur Rahman, Hadi Mardani Kamali, Kimia Zamiri Azar, Farimah Farahmandi	SiPGuard: Run-Time System-in-Package Security Monitoring via Power Noise Variation.	IEEE Trans. Very Large Scale Integr. Syst.	2024	DBLP DOI BibTeX RDF
11	Jai-Ming Lin, Tsung-Lin Tsai, Tsung-Chun Tsai	Multilevel Fixed-Outline Component Placement and Graph-Based Ball Assignment for System in Package.	IEEE Trans. Very Large Scale Integr. Syst.	2023	DBLP DOI BibTeX RDF
11	Mark Wade, Chen Sun 0003, Matthew Sysak, Vladimir Stojanovic, Pooya Tadayon, Ravi Mahajan, Babak Sabi	Driving Compute Scale-out Performance with Optical I/O Chiplets in Advanced System-in-Package Platforms.	HCS	2023	DBLP DOI BibTeX RDF
11	Jai-Ming Lin, Tsung-Chun Tsai, Rui-Ting Shen	Routability-Driven Orientation-Aware Analytical Placement for System in Package.	ICCAD	2023	DBLP DOI BibTeX RDF
11	Domenico Ribezzo, Mujtaba Zahidy, Antoine Petitjean, Gianmarco Lemmi, Claudia De Lazzari, Ilaria Vagniluca, Enrico Conca, Alberto Tosi, Tommaso Occhipinti, Francesco Saverio Cataliotti, Leif K. Oxenløwe, André Xuereb, Davide Bacco, Alessandro Zavatta	QKD protocol over 100 km long submarine optical fiber assisted by a system-in-package fast-gated InGaAs single photon detector.	OFC	2023	DBLP DOI BibTeX RDF
11	Aziz Oukaira, Dhaou Said, Jamal Zbitou, Ahmed Lakhssassi	Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC).	IMCOM	2023	DBLP DOI BibTeX RDF
11	Weijing Dai, Zhenkun Wang, Ke Xue	System-in-package design using multi-task memetic learning and optimization.	Memetic Comput.	2022	DBLP DOI BibTeX RDF
11	Aziz Oukaira, Dhaou Said, Jamal Zbitou, Ahmed Lakhssassi	Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM).	ICM	2022	DBLP DOI BibTeX RDF
11	Zhenyu Xu, Thomas Mauldin, Qing Yang 0001, Tao Wei	Highly Scalable Runtime Countermeasure Against Microprobing Attacks on Die-to-Die Interconnections in System-in-Package.	FPGA	2022	DBLP DOI BibTeX RDF
11	Zhenyu Xu, Qing Yang 0001, Tao Wei	A Novel Interconnection Architecture for Secured Die-to-Die Communication in System-in-Package.	NAS	2022	DBLP DOI BibTeX RDF
11	Van Ha Nguyen, Nueraimaiti Aimaier, Gabriel Nobert, Tan Pham, Nicolas G. Constantin, Yves Blaquière, Glenn E. R. Cowan	A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC Bare Dies on LTCC Substrate: Design - Implementation - Experiment and Future Directions.	NEWCAS	2022	DBLP DOI BibTeX RDF
11	Gregory Houzet, Thierry Lacrevaz, Cédric Bermond, Philippe Artillan, David Auchère, Laurent Schwarz, Bernard Fléchet	In-situ characterization up to 100 GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies.	Microelectron. J.	2021	DBLP DOI BibTeX RDF
11	Alexandre Robichaud, Dominic Deslandes, Paul-Vahé Cicek, Frederic Nabki	A System in Package Based on a Piezoelectric Micromachined Ultrasonic Transducer Matrix for Ranging Applications.	Sensors	2021	DBLP DOI BibTeX RDF
11	Jiao Chu, Jun Li 0104, Yunyan Zhou, Jia Cao, Pengwei Chen, Liqiang Cao	Si-based system-in-package design with broadband interconnection for E-band applications.	IEICE Electron. Express	2021	DBLP DOI BibTeX RDF
11	Hanxiang Zhu, Jun Li 0104, Qidong Wang, Liqiang Cao	Design of a Ka-band receiver front end using Si-based system in package.	IEICE Electron. Express	2021	DBLP DOI BibTeX RDF
11	Longsui Mo, Xuanjun Dai, Otilia Manta	Compatible process design and analysis of system-in-package.	ICIIP	2021	DBLP DOI BibTeX RDF
11	Stephen Adamshick, Sandhiya Reddy Govindarajulu, Elias A. Alwan	A Novel Low Loss 3D System-in-Package Approach for 60GHz Antenna on Chip Applications.	MWSCAS	2020	DBLP DOI BibTeX RDF
11	Vidushi Goyal, Xiaowei Wang, Valeria Bertacco, Reetuparna Das	Neksus: An Interconnect for Heterogeneous System-In-Package Architectures.	IPDPS	2020	DBLP DOI BibTeX RDF
11	JungHo Kang, Kyungsoo Chae, Jaeyoun Jeong	Connectivity Test for System in Package Interconnects.	J. Electron. Test.	2019	DBLP DOI BibTeX RDF
11	Pete Ehrett, Todd M. Austin, Valeria Bertacco	SiPterposer: A Fault-Tolerant Substrate for Flexible System-in-Package Design.	DATE	2019	DBLP DOI BibTeX RDF
11	Guicui Fu, Yutai Su, Wendi Guo, Bo Wan, Zhongqing Zhang, Ye Wang	Life prediction methodology of system-in-package based on physics of failure.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
11	Yen-Wei Chang, Ming-Che Yu, Hsien-Jia Lin, Chun-Hsing Li	Compact low-cost five-band RF energy harvester using system-in-package integration.	RWS	2018	DBLP DOI BibTeX RDF
11	Norbert Druml, Jürgen Schilling, Walther Pachler, Bernhard Roitner, Thomas Ruprechter, Holger Bock, Gerald Holweg	Secured miniaturized system-in-package contactless and passive authentication devices featuring NFC.	Microprocess. Microsystems	2017	DBLP DOI BibTeX RDF
11	Sergio Saponara, Gabriele Ciarpi, Filippo Giannetti	Analysis and Simulations of mmW Transceiver for System-in-Package Communications.	ApplePies	2017	DBLP DOI BibTeX RDF
11	Vijay N. Nair, L. Krishnamurthy, Johanna Swan, A. Essaian, Torrey W. Frank, Michael Bynum 0002	3D stacked embedded component system-in-package for wearable electronic devices.	RWS	2017	DBLP DOI BibTeX RDF
11	Sanju Thomas, Marina Cole, Farah-Helue Villa-Lopez, Julian W. Gardner, Jan Peters 0002, Jan Theunis	A low-cost acoustic microsensor based system in package for air quality monitoring.	IEEE SENSORS	2016	DBLP DOI BibTeX RDF
11	Jürgen Schilling, Walther Pachler, Bernhard Roitner, Thomas Ruprechter, Holger Bock, Gerald Holweg, Norbert Druml	Secured Miniaturized System-in-Package Contactless and Passive Authentication Devices Featuring NFC.	DSD	2016	DBLP DOI BibTeX RDF
11	Boyuan Zhu, Junwei Lu, Ling Sun 0009, Haiyan Sun	Computational electromagnetics in shielding analysis of system in package.	EMC Compo	2015	DBLP DOI BibTeX RDF
11	Nikolas Gaio, Linping Gao, Jinhe Cai, Jinyong Zhang, Lei Wang 0029	System-in-package solution for a low-power active electrode module.	EMBC	2014	DBLP DOI BibTeX RDF
11	Doug C. H. Yu	New System-in-Package (SiP) Integration technologies.	CICC	2014	DBLP DOI BibTeX RDF
11	Wen-Cheng Lai, Jhin-Fang Huang, Tin Ye, Wang-Tyng Lay	System in package of bandgap voltage reference circuit with sub-1-V operation in CMOS for communication control and BioMedical applications.	ChinaSIP	2014	DBLP DOI BibTeX RDF
11	Vrashank Shukla	Predictive transient circuit simulations of charged device model ESD events in system in package chips		2013	RDF
11	Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi	60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules.	IEICE Trans. Electron.	2012	DBLP DOI BibTeX RDF
11	Noriharu Suematsu, Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Tadashi Takagi, Kazuo Tsubouchi	A 60 GHz-Band 3-Dimensional System-in-Package Transmitter Module with Integrated Antenna.	IEICE Trans. Electron.	2012	DBLP DOI BibTeX RDF
11	Wai-Kei Mak, Yu-Chen Lin, Chris Chu, Ting-Chi Wang	Pad Assignment for Die-Stacking System-in-Package Design.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2012	DBLP DOI BibTeX RDF
11	John H. Lau, Tang Gong Yue	Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP).	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
11	Lei He 0001, Shauki Elassaad, Yiyu Shi 0001, Yu Hu 0002, Wei Yao 0002	System-in-Package: Electrical and Layout Perspectives.	Found. Trends Electron. Des. Autom.	2011	DBLP DOI BibTeX RDF
11	Hyemin Yang, Jongmoon Kim, Franklin Bien, Jongsoo Lee	Fully integrated UHF RFID mobile reader with power amplifiers using System-in-Package (SiP).	IEICE Electron. Express	2011	DBLP DOI BibTeX RDF
11	Yoshiaki Oizono, Yoshitaka Nabeshima, Takafumi Okumura, Toshio Sudo, Atsushi Sakai, Shiro Uchiyama, Hiroaki Ikeda	PDN impedance and SSO noise simulation of 3D system-in-package with a widebus structure.	3DIC	2011	DBLP DOI BibTeX RDF
11	Shih-Hsu Huang, Wen-Pin Tu, Hua-Hsin Yeh, Chun-Hua Cheng	Teaching three-dimensional system-in-package design automation in a semester course.	MSE	2011	DBLP DOI BibTeX RDF
11	Tong Ran, Guoqiang Bai 0001	Integration of information security chips based on System-in-Package.	ASICON	2011	DBLP DOI BibTeX RDF
11	Da-Chiang Chang, Yuan-Chia Hsu, Ta-Yeh Lin, Ying-Zong Juang, Ibrahim Haroun	Integrated Passive Device based RF circuit design for low-cost System-in-Package transceivers.	ISOCC	2011	DBLP DOI BibTeX RDF
11	Vladimir Hahanov, Aleksey Sushanov, Yulia Stepanova, Alexander Gorobets	System in Package. Diagnosis and embedded repair.	EWDTS	2010	DBLP DOI BibTeX RDF
11	Fulvio Infante, Philippe Perdu, Dean Lewis	Magnetic microscopy for 3D devices: Defect localization with high resolution and long working distance on complex system in package.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
11	Pier Paolo Stoppino, Armando Conci, Tito Lessio, Davide Ferrara	System in Package Feasibility Process.	Proc. IEEE	2009	DBLP DOI BibTeX RDF
11	Min Miao, Yufeng Jin, Hongguang Liao, Liwei Zhao, Yunhui Zhu, Xin Sun 0003, Yunxia Guo	Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration.	NEMS	2009	DBLP DOI BibTeX RDF
11	Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang	Pad assignment for die-stacking System-in-Package design.	ICCAD	2009	DBLP DOI BibTeX RDF
11	Jani Miettinen, Ville Pekkanen, Kimmo Kaija, Pauliina Mansikkamäki, Juha Mäntysalo, Matti Mäntysalo, Juha Niittynen, Jussi Pekkanen, Taavi Saviauk, Risto Rönkkä	Inkjet printed System-in-Package design and manufacturing.	Microelectron. J.	2008	DBLP DOI BibTeX RDF
11	Christian Gautier, Sophie Ledain, Sébastien Jacqueline, Matthieu Nongaillard, Vincent Georgel, Karine Danilo	Silicon based system in package: Improvement of passive integration process to avoid TBMS failure.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
11	Peter Pessl, Manfred Preitnegger	System-in-Package und Class-D-Linetreibertechnologie - die Schlüssel zur erfolgreichen Optimierung von ADSL2+ Datenübertragungseinrichtungen.	Elektrotech. Informationstechnik	2006	DBLP DOI BibTeX RDF
11	Kaname Yamasaki, Iwao Suzuki, Azumi Kobayashi, Keiichi Horie, Yasuharu Kobayashi, Hideyuki Aoki, Hideki Hayashi, Kenichi Tada, Koki Tsutsumida, Keiichi Higeta	External memory BIST for system-in-package.	ITC	2005	DBLP DOI BibTeX RDF
11	Kenneth M. Brown	System in package "the rebirth of SIP".	CICC	2004	DBLP DOI BibTeX RDF
11	Cynthia Trigas, Stefan Doll, Joachim Kruecken	MRAM and microprocessor system-in-package: technology stepping stone to advanced embedded devices.	CICC	2004	DBLP DOI BibTeX RDF
11	Yong-Ha Song, S. G. Kim, S. B. Lee, K. J. Rhee, T. S. Kim	A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
11	Albert Lin	Taiwan foundry for system-in-package (SIP).	ASP-DAC	2000	DBLP DOI BibTeX RDF
11	King L. Tai	System-in-package (SIP): challenges and opportunities.	ASP-DAC	2000	DBLP DOI BibTeX RDF
11	Minqing Liu, Wayne Wei-Ming Dai	Modeling and analysis of integrated spiral inductors for RF system-in-package.	ASP-DAC	2000	DBLP DOI BibTeX RDF
7	Maurizio Paganini, Georg Kimmich, Stephane Ducrey, Guilhem Caubit, Vincent Coeffe	Portable multimedia SoC design: a global challenge.	DATE	2007	DBLP DOI BibTeX RDF
7	Martin Ouwerkerk, Frank J. Pasveer, Nur Engin	SAND: a modular application development platform for miniature wireless sensors.	BSN	2006	DBLP DOI BibTeX RDF
7	Mohammad Reza Nabavi, Stoyan N. Nihtianov	Design of reliable interface system for eddy current displacement sensors in vacuum environments1.	ISCAS	2008	DBLP DOI BibTeX RDF
7	André Ivanov	Session Abstract.	VTS	2006	DBLP DOI BibTeX RDF
7	Mostafa Borhani, Vafa Sedghi	An Acoustic Echo Canceller Chip.	IWSOC	2005	DBLP DOI BibTeX RDF
6	Kwang-Ting (Tim) Cheng	Cocktail approach to functional verification.	IEEE Des. Test Comput.	2007	DBLP DOI BibTeX RDF	validation, functional verification, multiprocessor SoC, SiP, BISR
6	Erick O. Torres, Min Chen, H. Pooya Forghani-zadeh, Vishal Gupta 0003, Neeraj Keskar, Lucas Andrew Milner, Hsuan-I Pan, Gabriel A. Rincón-Mora	SiP integration of intelligent, adaptive, self-sustaining power management solutions for portable applications.	ISCAS	2006	DBLP DOI BibTeX RDF
6	Yuxin Wang, Martin Margala	New Embedded Core Testing for System-on-Chips and System-in-Packages.	CCECE	2006	DBLP DOI BibTeX RDF
6	Jason Cong, Yan Zhang	Thermal-driven multilevel routing for 3-D ICs.	ASP-DAC	2005	DBLP DOI BibTeX RDF