Search results for "WB-PBGA"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
74	Norberto Eiji Nawa, Takeshi Furuhashi	A study on the effect of transfer of genes for the bacterial evolutionary algorithm.	KES (3)	1998	DBLP DOI BibTeX RDF
36	Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee	Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array.	IEEE Des. Test Comput.	2006	DBLP DOI BibTeX RDF	wire bonded plastic ball grid array, WB-PBGA, 40 Gb/s Serial Link, chip-to-chip serial link, SiP, System-in-Package
32	Shao Jiang, An Tong	Reliability of PBGA Solder Joints under Random Vibration Load.	Int. J. Perform. Eng.	2020	DBLP DOI BibTeX RDF
32	Tong An, Chao Fang, Fei Qin, Huaicheng Li, Tao Tang, Pei Chen	Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
32	Yeong K. Kim, Do Soon Hwang	PBGA packaging reliability assessments under random vibrations for space applications.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
32	Chung-Neng Huang, Chong-Ching Chang	Optimal-Parameter Determination by Inverse Model Based on MANFIS: The Case of Injection Molding for PBGA.	IEEE Trans. Control. Syst. Technol.	2011	DBLP DOI BibTeX RDF
32	Ming-Yi Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai	Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
32	Yeong K. Kim, In Soo Park, Jooho Choi	Warpage mechanism analyses of strip panel type PBGA chip packaging.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
32	Mei-Ling Wu	Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
32	Y. S. Chen, C. S. Wang, Y. J. Yang	Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
32	Chi-Hui Chien, Thaiping Chen, Yung-Chang Chen, Yii-Tay Chiou, Chi-Chang Hsieh, Yii-Der Wu	Stability of the warpage in a PBGA package subjected to hygro-thermal loading.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
32	Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang	Thermal resistance analysis and validation of flip chip PBGA packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
32	T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma	The impact of moisture in mold compound preforms on the warpage of PBGA packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
32	Chi-Hui Chien, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, Yii-Der Wu	Influences of the moisture absorption on PBGA package's warpage during IR reflow process.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
32	Mohandass Sivakumar, Kripesh Vaidyanathan, Chong Ser Choong, Tai Chong Chai, Loon Aik Lim	Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly.	Microelectron. Reliab.	2002	DBLP DOI BibTeX RDF
32	S. C. Hung, P. J. Zheng, S. H. Ho, S. C. Lee, H. N. Chen, J. D. Wu	Board level reliability of PBGA using flex substrate.	Microelectron. Reliab.	2001	DBLP DOI BibTeX RDF
25	Sai Zeng, Russell S. Peak, Angran Xiao, Suresh K. Sitaraman	ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems.	Eng. Comput.	2008	DBLP DOI BibTeX RDF	Design-analysis integration, CAD-FEA interoperability, Product information model, Highly coupled variable topology multi-body (HCVTMB), GeoTran-HC
25	Francisco Bellas, José Antonio Becerra, Richard J. Duro	Internal and External Memory in Neuroevolution for Learning in Non-stationary Problems.	SAB	2008	DBLP DOI BibTeX RDF	non-stationary problems, learning, evolutionary algorithms, artificial neural networks, autonomous robotics
25	Jinwoo Choi, Sung-Hwan Min, Joong-Ho Kim, Madhavan Swaminathan, Wendemagegnehu T. Beyene, Chuck Yuan	Modeling and Analysis of Power Distribution Networks for Gigabit Applications.	IEEE Trans. Mob. Comput.	2003	DBLP DOI BibTeX RDF	transmission matrix method, power bus, decoupling, macromodeling, Power distribution network
25	Wendemagegnehu T. Beyene, Chuck Yuan, Joong-Ho Kim, Madhavan Swaminathan	Modeling and Analysis of Power Distribution Networks for Gigabit Applications.	ISQED	2003	DBLP DOI BibTeX RDF	Macro-modeling, reduced-order modeling and transmission matrix method, power distribution network
25	Wendemagegnehu T. Beyene, Chuck Yuan	On the Use of Windows for Accurate Analysis of Package Interconnects.	ISQED	2002	DBLP DOI BibTeX RDF