Search results for "lead-free"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
28	Tadahiro Shibutani, Qiang Yu, Masaki Shiratori	Effect of Creep Properties on Pressure Induced Tin Whisker Formation.	SSIRI	2008	DBLP DOI BibTeX RDF	lead-free, tin whisker, creep, tin-copper, tin-lead, pressure
26	Marwa S. S. Basyoni, Mostafa M. Salah, Mohamed Mousa, Ahmed Shaker, Abdelhalim Zekry, Mohamed Abouelatta, Mohammad T. Alshammari, Kawther A. Al-Dhlan, Christian Gontrand	On the Investigation of Interface Defects of Solar Cells: Lead-Based vs Lead-Free Perovskite.	IEEE Access	2021	DBLP DOI BibTeX RDF
26	S. B. Park, Rahul Joshi	Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
26	Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low	Drop impact reliability testing for lead-free and lead-based soldered IC packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
26	F. A. Stam, E. Davitt	Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints.	Microelectron. Reliab.	2001	DBLP DOI BibTeX RDF
20	Ming-Hung Shu, Bi-Min Hsu, Min-Chuan Hu	Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
20	Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee	Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package).	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
16	Md Ferdous Wahid, Md. Shahriar Rahman, Nowshad Ahmed, Abdullah Al Mamun, Md. Nuralam Howlader, Tarpan Paul, Md. Motiur Rahman Tareq, Md. Sazedur Rahman, Md. Mizanur Rahman	Performance Enhancement of Lead-Free CsSnI3 Perovskite Solar Cell: Design and Simulation With Different Electron Transport Layers.	IEEE Access	2024	DBLP DOI BibTeX RDF
16	Saeed Baghaee Ivriq, Kjeld Laursen, Aske Møller Jørgensen, Tanmay Mondal, Milad Zamani, Yasser Rezaeiyan, Brian Corbett, Bo Brummerstedt Iversen, Farshad Moradi	A System-Level Feasibility Study of a Lead-Free Ultrasonically Powered Light Delivery Implant for Optogenetics.	Adv. Intell. Syst.	2024	DBLP DOI BibTeX RDF
16	Cheng-Ying Li, Ze-Hui Chen, Hsueh-Yu Kao, Sheng-Kai Chang, Po-Yu Hsiao, Yen-Hsiang Huang, Yu-Chieh Huang, Sheng-Yuan Chu, Chia-Ling Wei, Yun-Hui Liu, Kuang-Wei Cheng, Cheng-Che Tsai	Design and Development of a Low-Power Wireless MEMS Lead-Free Piezoelectric Accelerometer System.	IEEE Trans. Instrum. Meas.	2023	DBLP DOI BibTeX RDF
16	Samah Al-Qaisi, Abdelazim M. Mebed, Muhammad Mushtaq, D. P. Rai, Tahani A. Alrebdi, Rais Ahmad Sheikh, Habib Rached, R. Ahmed, Muhammad Faizan, S. Bouzgarrou, Muhammad Anjum Javed	A theoretical investigation of the lead-free double perovskites halides Rb2XCl6 (X = Se, Ti) for optoelectronic and thermoelectric applications.	J. Comput. Chem.	2023	DBLP DOI BibTeX RDF
16	Min-Ku Lee, Byung-Hoon Kim, Gyoung-Ja Lee	Lead-Free Piezoelectric Acceleration Sensor Built Using a (K,Na)NbO3 Bulk Ceramic Modified by Bi-Based Perovskites.	Sensors	2023	DBLP DOI BibTeX RDF
16	A. Maoucha, Fayçal Djeffal, Hichem Ferhati	Numerical Investigation of a New Double-Absorber Lead-free Perovskite Solar Cell via SCAPS-1D.	CCE	2023	DBLP DOI BibTeX RDF
16	Swapnadeep Poddar, Zhesi Chen, Zichao Ma, Yuting Zhang, Chak Lam Jonathan Chan, Beitao Ren, Qianpeng Zhang, Daquan Zhang, Guozhen Shen, Haibo Zeng 0002, Zhiyong Fan	Robust Lead-Free Perovskite Nanowire Array-Based Artificial Synapses Exemplifying Gestalt Principle of Closure via a Letter Recognition Scheme.	Adv. Intell. Syst.	2022	DBLP DOI BibTeX RDF
16	Swapnadeep Poddar, Zhesi Chen, Zichao Ma, Yuting Zhang, Chak Lam Jonathan Chan, Beitao Ren, Qianpeng Zhang, Daquan Zhang, Guozhen Shen, Haibo Zeng 0002, Zhiyong Fan	Robust Lead-Free Perovskite Nanowire Array-Based Artificial Synapses Exemplifying Gestalt Principle of Closure via a Letter Recognition Scheme.	Adv. Intell. Syst.	2022	DBLP DOI BibTeX RDF
16	Gabriel Barrientos, Giacomo Clementi, Carlo Trigona, Merieme Ouhabaz, Ludovic Gauthier-Manuel, Djaffar Belharet, Samuel Margueron, Ausrine Bartasyte, Graziella Malandrino, Salvatore Baglio	Lead-Free LiNbO3 Thick Film MEMS Kinetic Cantilever Beam Sensor/Energy Harvester.	Sensors	2022	DBLP DOI BibTeX RDF
16	Danjela Kuscer, Brigita Kmet, Silvo Drnovsek, Julien Bustillo, Franck Levassort	Lead-Free Sodium Potassium Niobate-Based Multilayer Structures for Ultrasound Transducer Applications.	Sensors	2022	DBLP DOI BibTeX RDF
16	J. Lakshmi Prasanna, Ekta Goel, Amarjit Kumar, Atul Kumar	Computational Study of Perovskite/Perovskite Lead-free Tandem Solar Cell Devices.	iSES	2022	DBLP DOI BibTeX RDF
16	Dalel Missaoui, Ayda Bouhamed, Khawla Jeder, Amina Ben Ayed, Anouar Njeh, Olfa Kanoun	Flexible Lead-Free BCT/PDMS-Based Nanogenerator as Piezoelectric Energy Harvester.	SSD	2022	DBLP DOI BibTeX RDF
16	Syed Abdul Moiz, Ahmed Naif M. Alahmadi, Abdulah Jeza Aljohani	Design of a Novel Lead-Free Perovskite Solar Cell for 17.83% Efficiency.	IEEE Access	2021	DBLP DOI BibTeX RDF
16	Kyungmin Kim, Jinhee Yoo, Hae Gyun Lim, Mina Lee 0005, Sung-Min Park 0001, Hyung Ham Kim	Lead-Free Piezoelectric Composite With Lithium Niobate and Barium Titanate Fabricated by Interdigital Pair Bonding Technique.	IEEE Access	2021	DBLP DOI BibTeX RDF
16	Tomas Janusas, Sigita Urbaite, Arvydas Palevicius, Sohrab Nasiri, Giedrius Janusas	Biologically Compatible Lead-Free Piezoelectric Composite for Acoustophoresis Based Particle Manipulation Techniques.	Sensors	2021	DBLP DOI BibTeX RDF
16	Dong-Jin Shin, Woo-Seok Kang, Dong-Hwan Lim, Bo-Kun Koo, Min-Soo Kim, Soon-Jong Jeong, In-Sung Kim	Lead-Free AE Sensor Based on BZT-BCT Ceramics.	Sensors	2021	DBLP DOI BibTeX RDF
16	Chien-Min Hun, Ching-Ho Tien, Kuan-Lin Lee, Hong-Ye Lai, Lung-Chien Chen	The Effects of Temperature on the Growth of a Lead-Free Perovskite-Like (CH3NH3)3Sb2Br9 Single Crystal for An MSM Photodetector Application.	Sensors	2021	DBLP DOI BibTeX RDF
16	Paola Sabrina Barbato, Valeria Casuscelli, Paolo Aprea, Rossana Scaldaferri, Domenico Caputo	Assessing lead-free barium zirconate titanate-barium calcium titanate thin films ferroelectric properties in planar configuration.	RTSI	2021	DBLP DOI BibTeX RDF
16	Shangfen Huang, Haixia Li, Jun Liu, Jun Tao, Otilia Manta	The application prospects of lead-free piezoelectric ceramics in the field of transducers.	ICIIP	2021	DBLP DOI BibTeX RDF
16	Sarra Missaoui, Ayda Bouhamed, Mohamed Hassan Khedri, Hamadi Khemakhem, Olfa Kanoun	Enhanced piezoelectric performance of lead free BCZT based flexible nanogenerator.	SSD	2021	DBLP DOI BibTeX RDF
16	Amina Ben Ayed, Ayda Bouhamed, Hanen Nouri, Hamadi Khemakhem, Olfa Kanoun	Tuning the Performance of Flexible Lead-Free Zn-BCZT/PVDF-HFP Piezoelectric Nanogenerator.	SSD	2021	DBLP DOI BibTeX RDF
16	Mariya P. Aleksandrova, Ivailo M. Pandiev	Application of Thin Film Ultralow-Power Lead-Free Perovskite Solar Energy Harvesters in Power Management Systems.	MIXDES	2021	DBLP DOI BibTeX RDF
16	Chien-Ming Huang 0004, Anto Raj, Michael D. Osterman, Michael G. Pecht	Assembly Options and Challenges for Electronic Products With Lead-Free Exemption.	IEEE Access	2020	DBLP DOI BibTeX RDF
16	Ondrej Rubes, Zdenek Machu, Oldrich Sevecek, Zdenek Hadas	Crack Protective Layered Architecture of Lead-Free Piezoelectric Energy Harvester in Bistable Configuration.	Sensors	2020	DBLP DOI BibTeX RDF
16	Neetu Kumari, Micky Rakotondrabe	Development, presentation and tests of a hybrid thermal vibrational energy harvester based on lead free piezoelectric material.	ICECOCS	2020	DBLP DOI BibTeX RDF
16	Ayda Bouhamed, Qin Binyu, Olfa Kanoun	Flexible lead-free piezoelectric polymer composite nanogenerator with enhanced crystallinity.	SSD	2020	DBLP DOI BibTeX RDF
16	Ruimin Chen, Laiming Jiang, Tianfu Zhang, Takayuki Matsuok, Masato Yamazaki, Xuejun Qian, Gengxi Lu, Ahmad Safari, Jianguo Zhu 0004, K. Kirk Shung, Teng Ma, Qifa Zhou	Eco-Friendly Highly Sensitive Transducers Based on a New KNN-NTK-FM Lead-Free Piezoelectric Ceramic for High-Frequency Biomedical Ultrasonic Imaging Applications.	IEEE Trans. Biomed. Eng.	2019	DBLP DOI BibTeX RDF
16	H. Alex Hsain	Electronic Waste and the Special Case of Lead-Free Piezoelectrics: A Call for Legislative Action.	ISTAS	2019	DBLP DOI BibTeX RDF
16	A. A. El-Daly, A. A. Ibrahiem	Influence of rotating magnetic field on solidification microstructure and tensile properties of Sn-Bi lead-free solders.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
16	Mei-Ling Wu, Jia-Shen Lan	Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
16	Shi-Qian Liu, Stuart D. McDonald, Keith W. Sweatman, Kazuhiro Nogita	The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
16	T. Fujiwara, K. Yamamoto, Hidehiko Kimura	Quantification of lead-free solder fatigue by EBSD analysis.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
16	A. E. Hammad	Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
16	Junshan Zhang, Wei Ren, Yantao Liu, Xiaoqing Wu, Chunlong Fei, Yi Quan, Qifa Zhou	Fabrication and Characterization of High-Frequency Ultrasound Transducers Based on Lead-Free BNT-BT Tape-Casting Thick Film.	Sensors	2018	DBLP DOI BibTeX RDF
16	Paul Wild, Tobias Grözinger, Dominik Lorenz, André Zimmermann	Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates.	IEEE Trans. Reliab.	2017	DBLP DOI BibTeX RDF
16	Huizhen Huang, Gewang Shuai, Xiuqin Wei, Chuanqiang Yin	Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
16	Aleksandra Fortier, Michael G. Pecht	A perspective of the IPC report on lead-free electronics in military/aerospace applications.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
16	Muhammad Aamir 0006, Riaz Muhammad 0005, Naseer Ahmed, Muhammad Waqas 0001	Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
16	Mingna Wang, Jianqiu Wang, Wei Ke	Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
16	M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, Abdullah Aziz Saad, Mohd Zulkifly Abdullah	Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
16	Shunfeng Cheng, Chien-Ming Huang 0004, Michael G. Pecht	A review of lead-free solders for electronics applications.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
16	J. Thambi, U. Tetzlaff, Andreas Schiessl, Klaus-Dieter Lang, M. Waltz	High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
16	M. I. I. Ramli, N. Saud, M. A. A. Mohd Salleh, Mohd Nazree Derman, R. Mohd Said	Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
16	Bakhtiar Ali, Mohd Faizul Mohd Sabri, Iswadi Jauhari, Nazatul Liana Sukiman	Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
16	Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage	Effects of salt spray test on lead-free solder alloy.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
16	Muhannad Mustafa, Jeffrey C. Suhling, Pradeep Lall	Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
16	Michael G. Pecht, Tadahiro Shibutani, Lifeng Wu	A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
16	Van Nhat Le, Lahouari Benabou, Victor Etgens, Quang Bang Tao	Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
16	Ashish Tripathy, Sumit Pramanik, Ayan Manna, Satyanarayan Bhuyan, Nabila Farhana Azrin Shah, Zamri Radzi, Noor Azuan Abu Osman	Design and Development for Capacitive Humidity Sensor Applications of Lead-Free Ca, Mg, Fe, Ti-Oxides-Based Electro-Ceramics with Improved Sensing Properties via Physisorption.	Sensors	2016	DBLP DOI BibTeX RDF
16	Xiaomeng Li, Xiaoqing Wu, Peng Shi 0016, Zuo-Guang Ye	Lead-Free Piezoelectric Diaphragm Biosensors Based on Micro-Machining Technology and Chemical Solution Deposition.	Sensors	2016	DBLP DOI BibTeX RDF
16	Li Gu, Di Zhou, Jun Cheng Cao	Piezoelectric Active Humidity Sensors Based on Lead-Free NaNbO3 Piezoelectric Nanofibers.	Sensors	2016	DBLP DOI BibTeX RDF
16	Marco Laurenti, Denis Perrone, Alessio Verna, Candido Fabrizio Pirri, Alessandro Chiolerio	Development of a Flexible Lead-Free Piezoelectric Transducer for Health Monitoring in the Space Environment.	Micromachines	2015	DBLP DOI BibTeX RDF
16	Edwin Lillie, Peter Sandborn, David Humphrey	Assessing the value of a lead-free solder control plan using cost-based FMEA.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
16	F. X. Che, John H. L. Pang	Study on reliability of PQFP assembly with lead free solder joints under random vibration test.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
16	Chong Leong Gan, Uda Hashim	Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online).	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
16	R. Mahmudi, D. Farasheh	Impression creep behavior of Zn-4Al-3Mg-xSn high-temperature lead-free solders.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
16	Yongxin Zhu, Xiaoyan Li, Chao Wang, Ruiting Gao	A new creep-fatigue life model of lead-free solder joint.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
16	Alexey Vl. Filimonov, Ekaterina Yu Koroleva, Alexander Naberezhnov, Sergej B. Vakhrushev, Tikhon Yu Vergentiev	Ultrabroadband Dielectric Spectroscopy of Lead-Free Relaxor Ferroelectric Na1/2Bi1/2TiO3.	NEW2AN	2015	DBLP DOI BibTeX RDF
16	Ahmad Mayyas, Awni Qasaimeh, Peter Borgesen, Michael Meilunas	Effects of latent damage of recrystallization on lead free solder joints.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	Emmanuelle S. Freitas, Wislei R. Osório, José E. Spinelli, Amauri Garcia	Mechanical and corrosion resistances of a Sn-0.7 wt.%Cu lead-free solder alloy.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	Jürgen Eckermann, Shahid Mehmood, Helen Davies, Nick P. Lavery, Stephen G. R. Brown, Johann Sienz, A. Jones, P. Sommerfeld	Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	R. Mahmudi, D. Farasheh	Microstructure and elevated-temperature shear strength of Zn-4Al-3Mg-xSn high-temperature lead-free solders.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	Chaoran Yang, Fubin Song, S. W. Ricky Lee	Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	Yee-Wen Yen, Ruo-Syun Syu, Chih-Ming Chen 0002, Chien-Chung Jao, Guan-Da Chen	Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	Yongxin Zhu, Xiaoyan Li, Ruiting Gao, Chao Wang	Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	Mathias Ekpu, Raj S. Bhatti, Michael I. Okereke, Sabuj Mallik, Kenny C. Otiaba	Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	Fang Liu, Guang Meng	Random vibration reliability of BGA lead-free solder joint.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	Liang Zhang, Ji-guang Han, Yong-huan Guo, Cheng-wen He	Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	Jun Shen, Zhongming Cao, Dajun Zhai, Mali Zhao, Peipei He	Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
16	Hideharu Kato, Shingo Nakata, Noriaki Ikenaga, Hiroaki Sugita	Improvement of Chip Evacuation in Drilling of Lead-Free Brass Using Micro Drill.	Int. J. Autom. Technol.	2014	DBLP DOI BibTeX RDF
16	Nicola Delmonte, Francesco Giuliani, Paolo Cova	Finite element modeling and characterization of lead-free solder joints fatigue life during power cycling of surface mounting power devices.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
16	Yao Yao 0003, Leon M. Keer	Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
16	Vithyacharan Retnasamy, Zaliman Sauli, Nurul Izza Mohd Nor, Moganraj Palianysamy, Rizalafande Che Ismail, Ong Tee Say, Hussin Kamarudin	Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder.	UKSim	2013	DBLP DOI BibTeX RDF
16	Tingbi Luo, Anmin Hu, Jing Hu, Ming Li, Dali Mao	Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
16	Dhafer Abdulameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che	Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
16	Salomeh Tabatabaei, Ashavani Kumar, Haleh Ardebili, Peter J. Loos, Pulickel M. Ajayan	Synthesis of Au-Sn alloy nanoparticles for lead-free electronics with unique combination of low and high melting temperatures.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
16	Emeka H. Amalu, Ndy N. Ekere	High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
16	Liang Zhang, Cheng-wen He, Yong-huan Guo, Ji-guang Han, Yong-wei Zhang, Xu-yan Wang	Development of SnAg-based lead free solders in electronics packaging.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
16	P. Ratanapreechachai, Isaku Kanno, M. Sato	Sputtering Deposition of Lead-free Piezoelectric (K, Na)NbO3 Thin Films.	ICETET	2012	DBLP DOI BibTeX RDF
16	Seiji Nakashima, Yusuke Takada, Taiki Ito, Syota Seto, Hironori Fujisawa, Masafumi Kobune, Masaru Shimizu	Preparation and Characterization of High Quality Lead-free BiFeO3 Thin Films by Sputtering Process.	ICETET	2012	DBLP DOI BibTeX RDF
16	Pradeep Lall, Chandan Bhat, Madhura Hande, Vikrant More, Rahul Vaidya, Kai Goebel	Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads.	IEEE Trans. Ind. Electron.	2011	DBLP DOI BibTeX RDF
16	Davide Di Maio, Owen Thomas, Milos Dusek, Christopher Hunt	Novel Testing Instrument for Lead-Free Solder Characterization.	IEEE Trans. Instrum. Meas.	2011	DBLP DOI BibTeX RDF
16	H. Tsukamoto, T. Nishimura, S. Suenaga, Stuart D. McDonald, Keith W. Sweatman, Kazuhiro Nogita	The influence of solder composition on the impact strength of lead-free solder ball grid array joints.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
16	Y. A. Su, Long Bin Tan, T. Y. Tee, Vincent B. C. Tan	Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
16	Krishna Tunga, Suresh K. Sitaraman	Laser moiré interferometry for fatigue life prediction of lead-free solders.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
16	E. Kamara, Hua Lu 0003, Chris Bailey 0001, Chris Hunt, Davide Di Maio, Owen Thomas	A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
16	Elena Aksel, Jacob L. Jones	Advances in Lead-Free Piezoelectric Materials for Sensors and Actuators.	Sensors	2010	DBLP DOI BibTeX RDF
16	Sabine Körbel, Christian Elsässer	Cu Substitutionals and Defect Complexes in the Lead-Free Ferroelectric KNN.	High Performance Computing in Science and Engineering	2010	DBLP DOI BibTeX RDF
16	Matthias Scheller Lichtenauer, Silvania Avelar, Grzegorz Toporek	Segmentation of Images of Lead Free Solder.	ICISP	2010	DBLP DOI BibTeX RDF
16	Yi-Wun Wang, Y. W. Lin, C. Robert Kao	Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
16	Pradeep Lall, Madhura Hande, Chandan Bhat, Vikrant More, Rahul Vaidya	Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
16	Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto, Jianmin Qu	Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
16	S. T. Jenq, Hsuan-Hu Chang, Yi-Shao Lai, Tsung-Yueh Tsai	High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF