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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 2 occurrences of 2 keywords
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Results
Found 13 publication records. Showing 13 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
76 | Vassilios Gerousis |
Physical design implementation for 3D IC: methodology and tools. |
ISPD |
2010 |
DBLP DOI BibTeX RDF |
3D IC stack, micro-bump, physical design tools, silicon interposer, methodology, tsv |
27 | Mitsuhito Ando, Ryusuke Tokumine, Toshinobu Takei, Hiromi Mochiyama |
Tactile Scanning for Detecting Micro Bump by Strain-Sensitive Artificial Skin. |
IEEE Robotics Autom. Lett. |
2021 |
DBLP DOI BibTeX RDF |
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27 | Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Shunta Endo |
Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
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27 | Lay Wai Kong, Osborne A. Martin |
Known void size micro-bump, a novel standard of 3D X-ray computed tomography in-line metrology for accuracy assessment and monitoring. |
I2MTC |
2018 |
DBLP DOI BibTeX RDF |
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27 | Erik Jan Marinissen, Ferenc Fodor, Bart De Wachter, Jorg Kiesewetter, Eric Hill, Ken Smith |
A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards. |
ITC-Asia |
2017 |
DBLP DOI BibTeX RDF |
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27 | Kuan-Te Wu, Jin-Fu Li 0001, Yun-Chao Yu, Chih-Sheng Hou, Chi-Chun Yang, Ding-Ming Kwai, Yung-Fa Chou, Chih-Yen Lo |
Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs. |
ATS |
2014 |
DBLP DOI BibTeX RDF |
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27 | Jin-Tai Yan, Yu-Jen Tseng, Chia-Heng Yen |
Efficient micro-bump assignment for RDL routing in 3DICs. |
ICECS |
2014 |
DBLP DOI BibTeX RDF |
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27 | Ta-Yu Kuan, Yi-Chun Chang, Tai-Chen Chen |
Micro-bump assignment for 3D ICs using order relation. |
ASP-DAC |
2012 |
DBLP DOI BibTeX RDF |
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27 | Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen |
Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. |
3DIC |
2011 |
DBLP DOI BibTeX RDF |
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27 | Myeong-Hyeok Jeong, Jae-Won Kim, Byung-Hyun Kwak, Young-Bae Park, Byoung-Joon Kim, Young-Chang Joo |
Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. |
BIODEVICES |
2011 |
DBLP BibTeX RDF |
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27 | Ken Smith, Peter Hanaway, Mike Jolley, Reed Gleason, Eric Strid, Tom Daenen, Luc Dupas, Bruno Knuts, Erik Jan Marinissen, Marc Van Dievel |
Evaluation of TSV and micro-bump probing for wide I/O testing. |
ITC |
2011 |
DBLP DOI BibTeX RDF |
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27 | Nobuaki Miyakawa, Eiri Hashimoto, Takanori Maebashi, Natsuo Nakamura, Yutaka Sacho, Shigeto Nakayama, Shinjiro Toyoda |
Stacking technology based on 8-inch wafers using direct connection between TSV and micro-bump. |
CICC |
2008 |
DBLP DOI BibTeX RDF |
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19 | Nobuaki Miyakawa |
A 3D prototyping chip based on a wafer-level stacking technology. |
ASP-DAC |
2009 |
DBLP DOI BibTeX RDF |
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