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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 84 occurrences of 76 keywords
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Results
Found 231 publication records. Showing 231 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
92 | Andrew B. Kahng, Ion I. Mandoiu, Xu Xu 0001, Alexander Zelikovsky |
Enhanced Design Flow and Optimizations for Multiproject Wafers. |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. |
2007 |
DBLP DOI BibTeX RDF |
|
77 | Sampath Rangarajan, Donald S. Fussell, Miroslaw Malek |
Built-In Testing of Integrated Circuit Wafers. |
IEEE Trans. Computers |
1990 |
DBLP DOI BibTeX RDF |
integrated circuit wafers, silicon wafers, VLSI, integrated circuit testing, automatic testing, built-in testing, production testing |
64 | Toshiro Kubota, Parag Talekar, Xianyun Ma, Tangali S. Sudarshan |
A nondestructive automated defect detection system for silicon carbide wafers. |
Mach. Vis. Appl. |
2005 |
DBLP DOI BibTeX RDF |
|
50 | Chien-Chang Chen, Wai-Kei Mak |
A multi-technology-process reticle floorplanner and wafer dicing planner for multi-project wafers. |
ASP-DAC |
2006 |
DBLP DOI BibTeX RDF |
|
50 | Meng-Chiou Wu, Rung-Bin Lin |
A Comparative Study on Dicing of Multiple Project Wafers. |
ISVLSI |
2005 |
DBLP DOI BibTeX RDF |
|
50 | Meng-Chiou Wu, Rung-Bin Lin |
Reticle floorplanning of flexible chips for multi-project wafers. |
ACM Great Lakes Symposium on VLSI |
2005 |
DBLP DOI BibTeX RDF |
mask cost, multi-project wafer, reticle floorplanning, dicing |
42 | Brian Moore 0001, Martin Margala, Christopher J. Backhouse |
Design of wireless on-wafer submicron characterization system. |
IEEE Trans. Very Large Scale Integr. Syst. |
2005 |
DBLP DOI BibTeX RDF |
|
42 | Sameer T. Shikalgar, David Fronckowiak, Edward A. MacNair |
Wafer fabrication: 300mm wafer fabrication line simulation model. |
WSC |
2002 |
DBLP DOI BibTeX RDF |
|
41 | Meng-Chiou Wu, Rung-Bin Lin, Shih-Cheng Tsai |
Chip placement in a reticle for multiple-project wafer fabrication. |
ACM Trans. Design Autom. Electr. Syst. |
2008 |
DBLP DOI BibTeX RDF |
Multiple-project wafers (MPW), compatibility graph, reticle floorplanning, shuttle mask, wafer dicing, simulated annealing (SA), set cover, mixed-integer linear programming (MILP), conflict graph, set partition |
41 | Royce L. S. Ching, Evangeline F. Y. Young |
Shuttle mask floorplanning with modified alpha-restricted grid. |
ACM Great Lakes Symposium on VLSI |
2006 |
DBLP DOI BibTeX RDF |
multi-project wafers, reticle design |
41 | Andrew B. Kahng, Ion I. Mandoiu, Qinke Wang, Xu Xu 0001, Alexander Zelikovsky |
Multi-project reticle floorplanning and wafer dicing. |
ISPD |
2004 |
DBLP DOI BibTeX RDF |
multi-project wafers, reticle design, wafer dicing |
36 | Martin D. F. Wong |
Reticle Floorplanning with Guaranteed Yield for Multi-Project Wafers. |
ICCD |
2004 |
DBLP DOI BibTeX RDF |
|
36 | D. Bhatia |
Restructuring wafers for maximum yield and some applications of WSI. |
SPDP |
1990 |
DBLP DOI BibTeX RDF |
|
28 | Jagadish Jampani, Scott J. Mason |
Column generation heuristics for multiple machine, multiple orders per job scheduling problems. |
Ann. Oper. Res. |
2008 |
DBLP DOI BibTeX RDF |
Column generation, Semiconductor manufacturing, Machine scheduling |
28 | Fehmi Tanrisever, Erhan Kutanoglu |
Forming and scheduling jobs with capacitated containers in semiconductor manufacturing: Single machine problem. |
Ann. Oper. Res. |
2008 |
DBLP DOI BibTeX RDF |
Job formation, Multi-order jobs, Scheduling, Dynamic programming, Batching |
28 | Chuan-Yu Chang, Hung-Jen Wang, Si-Yan Lin |
Simulation Studies of Two-Layer Hopfield Neural Networks for Automatic Wafer Defect Inspection. |
IEA/AIE |
2006 |
DBLP DOI BibTeX RDF |
|
28 | Emilio Miguelañez Martín, Ali M. S. Zalzala, Paul Buxton |
Swarm intelligence in automated electrical wafer sort classification. |
Congress on Evolutionary Computation |
2005 |
DBLP DOI BibTeX RDF |
|
28 | Adit D. Singh |
T2: Statistical Methods for VLSI Test and Burn-in Optimization. |
Asian Test Symposium |
2005 |
DBLP DOI BibTeX RDF |
|
28 | Erik Hertzler, David Van Sickle |
300mm time constrained queue loop management. |
WSC |
2005 |
DBLP BibTeX RDF |
|
28 | Chuan-Yu Chang, Jia-Wei Chang, MuDer Jeng |
Using a self-organizing neural network for wafer defect inspection. |
SMC (5) |
2004 |
DBLP DOI BibTeX RDF |
|
28 | Jun-ho Jeong, Young-suk Sim, Hyonkee Sohn, Eung-sug Lee |
UV Nanoimprint Lithography Using an Elementwise Embossed Stamp. |
ICMENS |
2004 |
DBLP DOI BibTeX RDF |
|
28 | Syed M. Alam, Donald E. Troxel, Carl V. Thompson |
A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits. |
ISQED |
2002 |
DBLP DOI BibTeX RDF |
3D integrated circuit, 3D IC layout, inter-wafer via, reliability CAD tool, FPGA, performance analysis, reliability analysis |
28 | Frederic Duvivier |
Automatic Detection of Spatial Signature on Wafermaps in a High Volume Production. |
DFT |
1999 |
DBLP DOI BibTeX RDF |
wafermap, spatial signature, automated data collection, yield |
28 | Frederick L. Taber |
An introduction to area array probing. |
ITC |
1998 |
DBLP DOI BibTeX RDF |
|
28 | M. J. Little, R. David Etchells, Jan Grinberg, S. P. Laub, J. G. Nash, M. W. Yung |
The 3-D Computer. |
J. VLSI Signal Process. |
1990 |
DBLP DOI BibTeX RDF |
|
28 | José Pineda de Gyvez, Jochen A. G. Jess |
On the design and implementation of a wafer yield editor. |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. |
1989 |
DBLP DOI BibTeX RDF |
|
27 | Fred J. Meyer, Dhiraj K. Pradhan |
Modeling Defect Spatial Distribution. |
IEEE Trans. Computers |
1989 |
DBLP DOI BibTeX RDF |
defect spatial distribution modelling, center-satellite model, wafers, redundancy techniques, cluster, VLSI, fault tolerant computing, circuit CAD, fault-tolerant designs, yield models, WSI |
22 | Qingshan Tang, Xinwei Huang, Yongqi Miao, Jiang Huang |
A robust algorithm for rapid pre-alignment of multiple types and sizes of wafers. |
Signal Image Video Process. |
2024 |
DBLP DOI BibTeX RDF |
|
22 | Fei Yu, Min Xu, Junhua Wang, Xiangchao Zhang, Xinlan Tang |
Balancing the Efficiency and Sensitivity of Defect Inspection of Non-Patterned Wafers with TDI-Based Dark-Field Scattering Microscopy. |
Sensors |
2024 |
DBLP DOI BibTeX RDF |
|
22 | Jun Dong, Chunming Ye |
Joint optimisation of uncertain distributed manufacturing and preventive maintenance for semiconductor wafers considering multi-energy complementary. |
Int. J. Prod. Res. |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Qinghua Zhu 0001, GengHong Wang, NaiQi Wu, Yan Qiao, Yan Hou, MengChu Zhou, SiDe Zhao |
Scheduling Single-Arm Multicluster Tools for Two-Type Wafers With Lower-Bound Cycle Time. |
IEEE Trans. Syst. Man Cybern. Syst. |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales 0001, Roberto Sánchez-Reolid, Antonio Fernández-Caballero 0001 |
Defect detection and classification on semiconductor wafers using two-stage geometric transformation-based data augmentation and SqueezeNet lightweight convolutional neural network. |
Comput. Ind. Eng. |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Souvik Ghosh 0001, Quentin Smets, S. Banerjee, Tom Schram, K. Kennes, R. Verheyen, P. Kumar, M.-E. Boulon, Benjamin Groven, H. M. Silva, S. Kundu, Daire Cott, Dennis Lin, P. Favia, T. Nuytten, A. Phommahaxay, Inge Asselberghs, C. De La Rosa, Gouri Sankar Kar, Steven Brems |
Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer. |
VLSI Technology and Circuits |
2023 |
DBLP DOI BibTeX RDF |
|
22 | GengHong Wang, Qinghua Zhu 0001, Yan Hou, Yan Qiao, NaiQi Wu, MengChu Zhou |
Optimally Scheduling Single-Arm Multicluster Tools for Manufacturing Hybrid-Type Wafers. |
SMC |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Yun Gao, Noah Pestana, Skylar Deckoff-Jones, Jiajiu Zheng, Jordan Goldstein, Andrew M. Netherton, Ren-Jye Shiue, Michael R. Watts, Christopher V. Poulton |
Passive Integrated Athermal (De)Multiplexers on 300 mm Silicon Photonics Wafers. |
OFC |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Luigi Fassio, Hoang Hong Hanh, Massimo Alioto |
A Resistor/Trimming-Less Self-Biased Current Reference Class with Area Down to $3,500\ \mu \mathrm{m}^{2}$, 42.8 pW Power and 10.4% Accuracy across Corner Wafers in 180 nm. |
A-SSCC |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Hongwei Xu, Wei Qin, Youlong Lv, Jie Zhang 0041 |
Data-Driven Adaptive Virtual Metrology for Yield Prediction in Multibatch Wafers. |
IEEE Trans. Ind. Informatics |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Chen Shang, Kaiyin Feng, Eamonn T. Hughes, Andrew Clark, Mukul Debnath, Rosalyn Koscica, Gerald Leake, Joshua Herman, David Harame, Peter Ludewig, Yating Wan, John E. Bowers 0001 |
Electrically pumped quantum-dot lasers grown on 300 mm patterned Si photonic wafers. |
CoRR |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Sean Hooten, Mudit Jain, Thomas Van Vaerenbergh, Peng Sun, Quentin Wilmart, M. Ashkan Seyedi, Zhihong Huang, Marco Fiorentino, Raymond G. Beausoleil |
Inverse-Designed Dual Layer c-Si/SiN Vertical Grating Couplers Tested on 300mm Wafers. |
OECC/PSC |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Tingting Leng, Jufeng Wang, Chunfeng Liu 0003 |
Scheduling of single-arm cluster tools mixedly processing two kinds of wafers. |
ICNSC |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Ankit Gupta 0010, Adrita Barari, Damini, Keerthi Kiran Jagannathachar, Seungwoo Lee, Janghoon Oh, Jungha Kim, Min-Joo Kim |
Identifying Combination of Defects and Unknown Defects on Semiconductor Wafers using Deep Learning and Hierarchical Reclustering. |
VLSID |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto |
3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers. |
Imaging Sensors and Systems |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Yu-Kun Lin, Bing-Fei Wu |
Machine Learning-Based Wheel Monitoring for Sapphire Wafers. |
IEEE Access |
2021 |
DBLP DOI BibTeX RDF |
|
22 | Hiroaki Kudo, Tetsuya Matsumoto, Kentaro Kutsukake, Noritaka Usami |
Occurrence Prediction of Dislocation Regions in Photoluminescence Image of Multicrystalline Silicon Wafers Using Transfer Learning of Convolutional Neural Network. |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci. |
2021 |
DBLP DOI BibTeX RDF |
|
22 | Yijian Jiang, Haoqi Tan, Yan Zhao |
Improving Optical and Electrical Properties of GaN Epitaxial Wafers and Enhancing Luminescent Properties of GaN-Based Light-Emitting-Diode with Excimer Laser Irradiation. |
Symmetry |
2021 |
DBLP DOI BibTeX RDF |
|
22 | Thomas Olschewski |
Defect Detection on Semiconductor Wafers by Distribution Analysis. |
CoRR |
2021 |
DBLP BibTeX RDF |
|
22 | Yuanyuan Yan, Qinghua Tao, Huangang Wang, Wenhui Fan |
Noncyclic Scheduling of Multi-cluster Tools with Multi-type Wafers Based on Pareto Optimization. |
ICCAE |
2021 |
DBLP DOI BibTeX RDF |
|
22 | Geert H. van Kollenburg, Mike Holenderski, Patrizia Vasquez, Nirvana Meratnia |
Predictive discarding of wafers based on power leakage predictions from single layer misalignment data. |
ISM |
2021 |
DBLP DOI BibTeX RDF |
|
22 | Kenneth M. Jabon, Christopher V. Poulton, Ren-Jye Shiue, Matthew J. Byrd, Zhan Su 0001, Mohammad H. Teimourpour, Scott Breitenstein, Ronald P. Millman, Dogan A. Atlas, Michael R. Watts, Erman Timurdogan |
Edge-Coupled Active and Passive Wafer-Scale Measurements on 300mm Silicon Photonics Wafers. |
OFC |
2021 |
DBLP BibTeX RDF |
|
22 | Marwa Sayed Salem, Abdullah J. Alzahrani, Rabie A. Ramadan, Adwan Alanazi 0001, Ahmed Shaker, Mohamed Abouelatta, Christian Gontrand, Mohammed Elbanna, Abdelhalim Zekry |
Physically Based Analytical Model of Heavily Doped Silicon Wafers Based Proposed Solar Cell Microstructure. |
IEEE Access |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Rui Wang 0058, Nan Chen 0002 |
Defect pattern recognition on wafers using convolutional neural networks. |
Qual. Reliab. Eng. Int. |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Ayumi Onaka-Masada, Takeshi Kadono, Ryosuke Okuyama, Ryo Hirose, Koji Kobayashi, Akihiro Suzuki, Yoshihiro Koga, Kazunari Kurita |
Reduction of Dark Current in CMOS Image Sensor Pixels Using Hydrocarbon-Molecular-Ion-Implanted Double Epitaxial Si Wafers. |
Sensors |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Christopher Hakoda, Eric S. Davis, Cristian Pantea, Vamshi Krishna Chillara |
Multi-Level Information Storage Using Engineered Electromechanical Resonances of Piezoelectric Wafers: A Concept Piezoelectric Quick Response (PQR) Code. |
Sensors |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Liang Zhu, Biao Mei, Weidong Zhu, Wei Li |
Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers. |
Sensors |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Zining Wang, Masayoshi Tomizuka |
Precise 3D Calibration of Wafer Handling Robot by Visual Detection and Tracking of Elliptic-shape Wafers. |
ICRA |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Martin Kleindienst, Stefan Koch 0002, Markus Reichhartinger |
Model-based Temperature Control of a Continuous Flow Heater for Efficient Processing of Silicon Wafers. |
CCTA |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Kazunari Kurita, Takeshi Kadono, Satoshi Shigematsu, Ryo Hirose, Ryosuke Okuyama, Ayumi Onaka-Masada, Hidehiko Okuda, Yoshihiro Koga |
Proximity Gettering Design of Hydrocarbon-Molecular-Ion-Implanted Silicon Wafers Using Dark Current Spectroscopy for CMOS Image Sensors. |
Sensors |
2019 |
DBLP DOI BibTeX RDF |
|
22 | Dervis Türkmen, Carina Dettenrieder, Pontus Forsberg, Andreas Mattsson, Fredrik Nikolajeff, Lars Österlund, Mikael Karlsson, Boris Mizaikoff |
Corrosion Detection by Infrared Attenuated Total Reflection Spectroscopy via Diamond-Like Carbon-Coated Silicon Wafers and Iron-Sensitive Dyes. |
Sensors |
2019 |
DBLP DOI BibTeX RDF |
|
22 | Dong Liu 0011, Chek Sing Teo, Wenyu Liang, Kok Kiong Tan |
Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle. |
IEEE Trans Autom. Sci. Eng. |
2019 |
DBLP DOI BibTeX RDF |
|
22 | Akihisa Kubota |
Surface Finishing of Single-Crystal SiC and GaN Wafers Using a Magnetic Tool in H2O2 Solution. |
Int. J. Autom. Technol. |
2019 |
DBLP DOI BibTeX RDF |
|
22 | Kei Sumita, Jun Takeyasu, Kimihiko Kato, Kasidit Toprasertpong, Mitsuru Takenaka, Shinichi Takagi |
Fabrication of High Quality InAs-on-Lnsulator Structures by Smart Cut Process with Reuse of InAs Wafers. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
22 | Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto |
Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
22 | Erman Timurdogan, Zhan Su 0001, Ren-Jye Shiue, Christopher V. Poulton, Matthew J. Byrd, Simon Xin, Michael R. Watts |
APSUNY Process Design Kit (PDKv3.0): O, C and L Band Silicon Photonics Component Libraries on 300mm Wafers. |
OFC |
2019 |
DBLP BibTeX RDF |
|
22 | Qiang Huan, Mingtong Chen, Faxin Li |
A Comparative Study of Three Types Shear Mode Piezoelectric Wafers in Shear Horizontal Wave Generation and Reception. |
Sensors |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Corinna Kofler, Robert Muhr, Gunter Spöck |
Detecting Star Cracks in Topography Images of Specular Back Surfaces of Structured Wafers. |
ICMLA |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Junji Senzaki, Shohei Hayashi, Yoshiyuki Yonezawa, Hajime Okumura |
Challenges to realize highly reliable SiC power devices: From the current status and issues of SiC wafers. |
IRPS |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Seungchul Lee, Daeyoung Kim |
Distributed-based Hierarchical Clustering System for Large-scale Semiconductor Wafers. |
IEEM |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Yanjun Lu, ChunRong Pan, Yan Qiao, Naiqi Wu, Yufeng Chen 0001 |
Petri net-based deadlock avoidance for single-arm cluster tools with concurrently processing two-type wafers. |
ICNSC |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Eiji Higurashi, Ken Okumura, Yutaka Kunimune, Tadatomo Suga, Kei Hagiwara |
Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method. |
IEICE Trans. Electron. |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Min-Seok Jang, Sung Woo Ma, Jongsoo Song, Myungmo Sung, Young-Ho Kim |
Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment. |
Microelectron. Reliab. |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Jiwon Yang, Seung-kyung Lee, Seokho Kang 0001, Sungzoon Cho, Young-Hak Lee, Hae-Sang Park |
Ranking process parameter association with low yield wafers using spec-out event network analysis. |
Comput. Ind. Eng. |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Tom Schram, Quentin Smets, Benjamin Groven, M. H. Heyne, E. Kunnen, A. Thiam, Katia Devriendt, Annelies Delabie, Dennis Lin, M. Lux, Daniele Chiappe, I. Asselberghs, S. Brus, Cedric Huyghebaert, S. Sayan, A. Juncker, Matty Caymax, Iuliana P. Radu |
WS2 transistors on 300 mm wafers with BEOL compatibility. |
ESSDERC |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Romain Ritzenthaler, Hans Mertens, An De Keersgieter, Jérôme Mitard, Dan Mocuta, N. Horiguchi |
Isolation of nanowires made on bulk wafers by ground plane doping. |
ESSDERC |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Arsham Abedini, Mahdi Ehsanian |
Defect detection on IC wafers based on neural network. |
ICM |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Corinna Kofler, Gunter Spöck, Robert Muhr |
Classifying defects in topography images of silicon wafers. |
WSC |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Jipeng Wang, Chunrong Pan, Hesuan Hu, Yuan Zhou 0005 |
Scheduling of single-arm cluster tools with multi-type wafers and shared PMs. |
CASE |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Pascual Muñoz |
Photonic integration in the palm of your hand: Generic technology and multi-project wafers, technical roadblocks, challenges and evolution. |
OFC |
2017 |
DBLP BibTeX RDF |
|
22 | Chunrong Pan, Kun Zhao, Yi-Sheng Huang |
Schedulability analysis for dual-armed cluster tools with mixed-processing of multi-variety wafers. |
ICNSC |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Bahadir Tunaboylu |
Power Delivery Performance of Probe Test Systems for Semiconductor Wafers. |
IEEE Des. Test |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Amarendra Kumar, Kunal Kashyap, Max T. Hou, J. Andrew Yeh |
Mechanical Strength and Broadband Transparency Improvement of Glass Wafers via Surface Nanostructures. |
Sensors |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Luca Pirro, Irina Ionica, Sorin Cristoloveanu, Gérard Ghibaudo |
Low-frequency noise in bare SOI wafers: Experiments and model. |
ESSDERC |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Sukeshwar Kannan, Rahul Agarwal, Arnaud Bousquet, Geetha Aluri, Hui-Shan Chang |
Device performance analysis on 20nm technology thin wafers in a 3D package. |
IRPS |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Qian Zhang, Boquan Li 0004, Zhi-quan Sun, Yu-Jun Li, Chang-yun Pan |
Solar Wafers Counting Based on Image Texture Feature. |
IGTA |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Kuldeep Shah, Eli Saber, Kevin Verrier |
Improved metrology of implant lines on static images of textured silicon wafers using line integral method. |
Image Processing: Machine Vision Applications |
2015 |
DBLP DOI BibTeX RDF |
|
22 | M. R. Dodge, F. Shadman |
Computer modeling of surface interactions and contaminant transport in microstructures during the rinsing of patterned semiconductor wafers. |
Comput. Chem. Eng. |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Aref Bakhtazad, Rayyan Manwar, Sazzadur Chowdhury |
Cavity formation in bonded silicon wafers using partially cured dry etch bisbenzocyclobutene (BCB). |
LASCAS |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Daivid Fowler, Charles Baudot, Jean-Marc Fedeli, B. Caire, Léopold Virot, A. Leliepvre, G. Grand, A. Myko, Delphine Marris-Morini, Sonia Messaoudene, Aurelie Souhaite, Ségolène Olivier, Philippe Grosse, Guang-Hua Duan, B. Ben Bakir, Frédéric Boeuf, Laurent Vivien, Sylvie Menezo |
Complete Si-photonics device-library on 300mm wafers. |
OFC |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Harpreet Singh Grover, Francis P. Dawson, Dave M. Camm, Yann Cressault, Markus Lieberer |
Application of a plasma Arc lamp for thermal processing of semiconductor wafers. |
IAS |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Melanie Po-Leen Ooi, Hong Kuan Sok, Ye Chow Kuang, Serge N. Demidenko, Chris Chan |
Defect cluster recognition system for fabricated semiconductor wafers. |
Eng. Appl. Artif. Intell. |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Melanie Po-Leen Ooi, Hong Kuan Sok, Ye Chow Kuang, Huiyuan Cheng, Eric Kwang Joo Sim, Serge N. Demidenko, Chris W. K. Chan |
Identifying Systematic Failures on Semiconductor Wafers Using ADCAS. |
IEEE Des. Test |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Hirokazu Fukidome, Yusuke Kawai, Hiroyuki Handa, Hiroki Hibino, Hidetoshi Miyashita, Masato Kotsugi, Takuo Ohkochi, Myung-Ho Jung, Tetsuya Suemitsu, Toyohiko Kinoshita, Taiichi Otsuji, Maki Suemitsu |
Site-Selective Epitaxy of Graphene on Si Wafers. |
Proc. IEEE |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Stefan Mitterhofer, Jakob D. Pühringer, Viktor Schlosser |
An acoustic set up for the vibration analysis of silicon wafers. |
IECON |
2013 |
DBLP DOI BibTeX RDF |
|
22 | He-Yau Kang, Amy H. I. Lee, Chun-Mei Lai |
An integrated replenishment model with quantity discounts, reentry and downward substitution for control wafers. |
J. Intell. Manuf. |
2012 |
DBLP DOI BibTeX RDF |
|
22 | W. Heo, Nae-Eung Lee |
Effect of additive N2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinning. |
Microelectron. Reliab. |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Philippe Gaubert, Akinobu Teramoto, Shigetoshi Sugawa, Tadahiro Ohmi |
The role of the temperature on the scattering mechanisms limiting the electron mobility in metal-oxide-semiconductor field-effect-transistors fabricated on (110) silicon-oriented wafers. |
ESSDERC |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Bong-Jin Yum, Jae Hoon Koo, Seong-Jun Kim |
Analysis of defective patterns on wafers in semiconductor manufacturing: A bibliographical review. |
CASE |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Gloria Rodríguez-Verján, Eric Tartiere, Jacques Pinaton, Stéphane Dauzère-Pérès, Alexis Thieullen |
Dispatching of lots to dynamically reduce the wafers at risk in semiconductor manufacturing. |
CASE |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Prem Pal, Kazuo Sato, Hirotaka Hida |
MEMS components with perfectly protected edges and corners in Si{110} wafers. |
MHS |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Ozren Gamulin, Maja Balarin, Mile Ivanda, Marin Kosovic, Vedran Derek, Lara Mikac, Kristina Serec, Kresimir Furic, Dubravka Krilov |
Micro and nano structure of electrochemically etched silicon epitaxial wafers. |
MIPRO |
2011 |
DBLP BibTeX RDF |
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22 | Jian-Yang Lin, Pai-Yu Chang |
KOH anisotropic etching of Si wafers for LED electrode arrays. |
NEMS |
2011 |
DBLP DOI BibTeX RDF |
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